Invention Grant
US07391143B2 Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit 有权
声谐振器,声谐振器和相应的集成电路的支持和去耦结构

Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
Abstract:
An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.
Information query
Patent Agency Ranking
0/0