Invention Grant
- Patent Title: Support and decoupling structure for an acoustic resonator, acoustic resonator and corresponding integrated circuit
- Patent Title (中): 声谐振器,声谐振器和相应的集成电路的支持和去耦结构
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Application No.: US11731942Application Date: 2007-04-02
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Publication No.: US07391143B2Publication Date: 2008-06-24
- Inventor: Guillaume Bouche , Gregory Caruyer , Pascal Ancey
- Applicant: Guillaume Bouche , Gregory Caruyer , Pascal Ancey
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics S.A.
- Current Assignee: STMicroelectronics S.A.
- Current Assignee Address: FR Montrouge
- Agency: Gardere Wynne Sewell LLP
- Priority: FR0214967 20021128
- Main IPC: H01L41/083
- IPC: H01L41/083

Abstract:
An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.
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