Invention Grant
- Patent Title: High performance semiconductor devices fabricated with strain-induced processes and methods for making same
- Patent Title (中): 用应变诱导工艺制造的高性能半导体器件及其制造方法
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Application No.: US11194084Application Date: 2005-07-29
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Publication No.: US07394136B2Publication Date: 2008-07-01
- Inventor: Chung-Hu Ke , Wen-Chin Lee , Yee-Chia Yeo , Chih-Hsin Ko , Chenming Hu
- Applicant: Chung-Hu Ke , Wen-Chin Lee , Yee-Chia Yeo , Chih-Hsin Ko , Chenming Hu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A high performance semiconductor device and the method for making same is disclosed with an improved drive current. The semiconductor device has source and drain regions built on an active region, a length of the device being different than a width thereof. One or more isolation regions are fabricated surrounding the active region, the isolation regions are then filled with an predetermined isolation material whose volume shrinkage exceeds 0.5% after an anneal process. A gate electrode is formed over the active region, and one or more dielectric spacers are made next to the gate electrode. Then, a contact etch stopper layer is put over the device, wherein the isolation regions, spacers and contact etch layer contribute to modulating a net strain imposed on the active region so as to improve the drive current.
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