Invention Grant
- Patent Title: Sealed compact power distribution module
- Patent Title (中): 密封紧凑型配电模块
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Application No.: US11010229Application Date: 2004-12-10
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Publication No.: US07396262B2Publication Date: 2008-07-08
- Inventor: Jacek M. Korczynski , Kerri M. Moore , Eric D. Ude , Richard E. Kriss , Frank Maine
- Applicant: Jacek M. Korczynski , Kerri M. Moore , Eric D. Ude , Richard E. Kriss , Frank Maine
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: H01R11/09
- IPC: H01R11/09

Abstract:
A sealed power distribution module includes a nonconductive body defining a terminal receptacle, a barrier seal engaged to and surrounding the body adjacent the receptacle on an exterior surface of the body, a terminal element grid fitted within the receptacle, and provisions for installing commercially available sealed terminals to complete the wiring. The grid is engaged to the body at a location interior to the barrier seal. The power distribution module may also include one or more bus bar assemblies oriented such that simultaneous switching of relay packages is possible.
Public/Granted literature
- US20060128230A1 Sealed compact power distribution module Public/Granted day:2006-06-15
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