发明授权
- 专利标题： Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same
- 专利标题（中）： 半导体元件散热构件，使用其的半导体装置及其制造方法
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申请号： US10538222申请日： 2003-12-09
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公开(公告)号： US07396735B2公开(公告)日： 2008-07-08
- 发明人: Kazuyuki Nakanishi , Tadashi Oshima , Hideo Hasegawa , Hiroyuki Mori , Hideo Tachikawa , Yukio Miyachi , Yasushi Yamada , Hiroyuki Ueda , Masayasu Ishiko
- 申请人： Kazuyuki Nakanishi , Tadashi Oshima , Hideo Hasegawa , Hiroyuki Mori , Hideo Tachikawa , Yukio Miyachi , Yasushi Yamada , Hiroyuki Ueda , Masayasu Ishiko
- 申请人地址： JP Aichi-gun
- 专利权人： Kabushiki Kaisha Toyota Chuo Kenkyusyo
- 当前专利权人： Kabushiki Kaisha Toyota Chuo Kenkyusyo
- 当前专利权人地址： JP Aichi-gun
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- 国际申请： PCT/JP03/15741 WO 20031209
- 国际公布： WO2004/053984 WO 20040624
- 主分类号： H01L21/76
- IPC分类号： H01L21/76
摘要：
A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.