Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11605092Application Date: 2006-11-28
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Publication No.: US07396761B2Publication Date: 2008-07-08
- Inventor: Sung-Kwan Kang , Jong-Wook Lee , Yong-Hoon Son , Yu-Gyun Shin , Jun-Ho Lee
- Applicant: Sung-Kwan Kang , Jong-Wook Lee , Yong-Hoon Son , Yu-Gyun Shin , Jun-Ho Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Mills & Onello LLP
- Priority: KR10-2005-0114476 20051129
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/4763 ; H01L21/44

Abstract:
In a semiconductor device and a method of manufacturing the semiconductor device, a plug and a channel structure are formed. The plug fills an opening and the channel structure extends upwardly from the plug. The channel structure has a substantially vertical sidewall. The opening is formed through an insulation structure located on a substrate. The plug and the channel structure comprise a material in a single crystalline state that is changed from an amorphous state by an irradiation of a laser beam. The channel structure is doped with impurities such as boron, phosphorus or arsenic.
Public/Granted literature
- US20070123062A1 Semiconductor device and method of manufacturing the same Public/Granted day:2007-05-31
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