Invention Grant
- Patent Title: Semiconductor sensor having weight of material different than that of weight arranging part
- Patent Title (中): 半导体传感器，其重量与重量配置部分不同
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Application No.: US11369283Application Date: 2006-03-06
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Publication No.: US07398684B2Publication Date: 2008-07-15
- Inventor: Kazunari Kimino
- Applicant: Kazunari Kimino
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham, LLP
- Priority: JP2005-066342 20050309
- Main IPC: G01P15/08
- IPC: G01P15/08
Abstract:
A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.
Public/Granted literature
- US20070240510A1 Semiconductor sensor and method of manufacturing the same Public/Granted day:2007-10-18
Information query
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