公开(公告)号：US07651724B2

公开(公告)日：2010-01-26

申请号：US11399315

申请日：2006-04-07

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: H05K3/28

CPC classification number: H01L21/6715 ,  H01L21/56 ,  H01L23/3114 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13022 ,  H01L2224/13024

Abstract: An apparatus and a method for manufacturing semiconductor devices implemented with improved steps of forming a sealant resin layer on the surface of a wafer substrate provided thereon with protruded electrodes. Through process steps of sending driving signals to a stage unit and discharging head based on the comparison with stage position information from stage position detector, and controlling the position of a substrate holding unit with the suction held semiconductor wafer substrate and the scanning movements of discharging mechanism such that minute liquid droplets of raw sealant resin are suitably discharged from discharging head, a raw sealant resin layer is formed on the surface the wafer substrate except the area for forming bump electrodes. The raw sealant resin layer is subsequently hardened to form a sealant resin layer. The reduction of manufacturing costs, and more precise control of location and thickness of the sealant resin become feasible by the method disclosed herein.

Abstract translation: 一种用于制造半导体器件的装置和方法，其具有在其上设置有突出电极的晶片衬底的表面上形成密封树脂层的改进步骤。 通过基于与载物台位置检测器的载物台位置信息的比较将驱动信号发送到载物台单元和放电头的处理步骤，以及控制具有吸持保持半导体晶片基板的基板保持单元的位置和排出机构的扫描运动 使得原始密封树脂的微小液滴适当地从排出头排出，除了用于形成凸块电极的区域之外，在晶片基板的表面上形成原始密封树脂层。 随后将原始的密封剂树脂层硬化以形成密封剂树脂层。 通过本文公开的方法，制造成本的降低和密封剂树脂的位置和厚度的更精确控制变得可行。

公开(公告)号：US09337234B2

公开(公告)日：2016-05-10

申请号：US14349414

申请日：2012-10-05

Applicant: Yutaka Hayashi ,  Toshitaka Ota ,  Yasushi Nagamune ,  Hirofumi Watanabe ,  Takaaki Negoro ,  Kazunari Kimino

Inventor： Yutaka Hayashi ,  Toshitaka Ota ,  Yasushi Nagamune ,  Hirofumi Watanabe ,  Takaaki Negoro ,  Kazunari Kimino

IPC: H01L27/146 ,  H04N5/3745 ,  H04N5/378 ,  H01L27/144

CPC classification number: H01L27/14681 ,  H01L27/1443 ,  H01L27/14609 ,  H01L27/14656 ,  H04N5/3745 ,  H04N5/378

Abstract: A photoelectric converter includes a first pn junction comprised of at least two semiconductor regions of different conductivity types, and a first field-effect transistor including a first source connected with one of the semiconductor regions, a first drain, a first insulated gate and a same conductivity type channel as that of the one of the semiconductor regions. The first drain is supplied with a second potential at which the first pn junction becomes zero-biased or reverse-biased relative to a potential of the other of the semiconductor regions. When the first source turns to a first potential and the one of the semiconductor regions becomes zero-biased or reverse-biased relative to the other semiconductor regions, the first pn junction is controlled not to be biased by a deep forward voltage by supplying a first gate potential to the first insulated gate, even when either of the semiconductor regions is exposed to light.

Abstract translation: 光电转换器包括由至少两个不同导电类型的半导体区组成的第一pn结，以及包括与半导体区之一连接的第一源的第一场效应晶体管，第一漏极，第一绝缘栅极和 导电型沟道，与半导体区域中的一个相同。 第一漏极被提供有第二电位，在该第二电位处，第一pn结相对于另一个半导体区域的电位变为零偏置或反向偏置。 当第一源极变为第一电位并且半导体区域中的一个相对于其它半导体区域变为零偏置或反向偏置时，通过提供第一源极的第一电位，第一pn结被控制为不被深的正向电压偏置， 即使当半导体区域中的任一个暴露于光时，第一绝缘栅极的栅极电位。

公开(公告)号：US20080265346A1

公开(公告)日：2008-10-30

申请号：US12109101

申请日：2008-04-24

Applicant: KAZUNARI KIMINO

Inventor： KAZUNARI KIMINO

IPC: H01L29/84 ,  H01L21/00

CPC classification number: G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084

Abstract: A semiconductor sensor and a manufacturing method of the same capable of making the specific gravity of a weight part to be greater than that of a weight part made of semiconductor material only is disclosed. The semiconductor sensor includes the weight part, a supporting part, a flexible part, and plural piezoresistive elements. The weight part includes a weight part photosensitive resin layer made of photosensitive resin in which metal particles are included. The supporting part surrounds and is separated from the weight part. The flexible part is provided between the weight part and the supporting part to support the weight part. The flexible part includes a flexible part semiconductor layer where the plural piezoresistive elements are formed. This configuration allows the specific gravity of the weight part photosensitive resin layer greater than that of the weight part semiconductor layer due to the metal particles.

Abstract translation: 公开了一种半导体传感器及其制造方法，其能够使重量部分的比重大于仅由半导体材料制成的重量部件的比重。 半导体传感器包括重量部分，支撑部分，柔性部分和多个压阻元件。 重量部分包括由包含金属颗粒的感光树脂制成的重量份感光性树脂层。 支撑部分包围并与重物部分分离。 柔性部分设置在重量部分和支撑部分之间以支撑重物部分。 柔性部件包括形成多个压电元件的柔性部件半导体层。 这种构造使得由于金属颗粒，重量部分感光性树脂层的比重大于重量部分半导体层的比重。

公开(公告)号：US20090061628A1

公开(公告)日：2009-03-05

申请号：US12213332

申请日：2008-06-18

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: H01L21/44

CPC classification number: H01L21/288 ,  H01L21/76892 ,  H01L23/5252 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer substrate, and a driving mechanism that moves at least one of the substrate holding section and the discharge nozzle. A control section is provided to control the discharge and driving mechanisms so as to adhere the metal paste to the surface. The semiconductor wafer substrate includes a terminal unit formed from two or more electrically separated terminals connected to a device circuit and an insulation layer having an opening in a formation position of the terminal unit. Further, the control section controls the discharge and driving mechanisms to selectively coat the opening of the semiconductor wafer substrate with the metal paste overlying the terminal unit to be electrically connected.

Abstract translation: 一种半导体器件制造装置，包括保持半导体晶片基板的基板保持部，将排出喷嘴的液滴从喷出喷嘴朝向半导体晶片基板的表面排出的排出机构，以及驱动机构， 基板保持部和排出喷嘴。 提供控制部分以控制排出和驱动机构，以将金属糊粘附到表面上。 半导体晶片基板包括由连接到器件电路的两个或更多个电分离端子和在端子单元的形成位置具有开口的绝缘层形成的端子单元。 此外，控制部分控制排出和驱动机构以覆盖在待电连接的终端单元上的金属浆料选择性地涂覆半导体晶片衬底的开口。

公开(公告)号：US07473319B2

公开(公告)日：2009-01-06

申请号：US11199253

申请日：2005-08-09

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: H01L23/525

CPC classification number: H01L23/5256 ,  F04D29/444 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus and a method for manufacturing semiconductor devices is disclosed for selectively disconnecting a fuse element out of plural fuse elements formed on a semiconductor wafer substrate which is provided with the plural fuse elements and a dielectric layer having at least one opening corresponding to the location for the plural fuse elements. The method includes processing steps implemented onto the wafer substrate, such as (a) forming a layer of etching barrier resin by scanning at least one discharging nozzle for discharging the raw etching barrier resin while suitably discharging droplets of raw etching barrier resin to replenish the opening corresponding to the location of the fuse element not to be disconnected, (b) hardening the raw etching barrier resin to be a layer of etching barrier resin, and (c) the fuse element in the prescribed disconnecting area without overlying portion of the etching barrier resin layer is selectively disconnected by etching using the dielectric layer and the etching barrier resin as a mask.

Abstract translation: 公开了一种用于制造半导体器件的装置和方法，用于选择性地断开形成在设置有多个熔丝元件的半导体晶片衬底上的多个熔丝元件中的熔丝元件，以及具有至少一个对应于 多个熔丝元件。 该方法包括在晶片衬底上执行的处理步骤，例如（a）通过扫描至少一个用于排出原始蚀刻阻挡树脂的排出喷嘴来形成蚀刻阻挡树脂层，同时适当地排出原始蚀刻阻挡树脂的液滴以补充开口 对应于不断开的熔丝元件的位置，（b）将原始蚀刻阻挡树脂硬化成为一层蚀刻阻挡树脂，和（c）在规定的断开区域中的熔丝元件，而不覆盖蚀刻阻挡层的一部分 通过使用电介质层和蚀刻阻挡树脂作为掩模的蚀刻来选择性地断开树脂层。

公开(公告)号：US20080241984A1

公开(公告)日：2008-10-02

申请号：US12133791

申请日：2008-06-05

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: H01L21/56

CPC classification number: G01P15/123 ,  G01P15/0802

Abstract: A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.

Abstract translation: 公开了一种半导体传感器，其包括至少包括半导体层的衬底。 基板包括在基板中心附近的重量配置部分，围绕配重部分的柔性部分和设置在柔性部分周围的支撑部分。 半导体传感器还包括布置在配重部分上的重物。 重量由与重量配置部分和柔性部分不同的材料制成。

公开(公告)号：US20060030153A1

公开(公告)日：2006-02-09

申请号：US11199253

申请日：2005-08-09

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: H01L21/302

CPC classification number: H01L23/5256 ,  F04D29/444 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus and a method for manufacturing semiconductor devices is disclosed for selectively disconnecting a fuse element out of plural fuse elements formed on a semiconductor wafer substrate which is provided with the plural fuse elements and a dielectric layer having at least one opening corresponding to the location for the plural fuse elements. The method includes processing steps implemented onto the wafer substrate, such as (a) forming a layer of etching barrier resin by scanning at least one discharging nozzle for discharging the raw etching barrier resin while suitably discharging droplets of raw etching barrier resin to replenish the opening corresponding to the location of the fuse element not to be disconnected, (b) hardening the raw etching barrier resin to be a layer of etching barrier resin, and (c) the fuse element in the prescribed disconnecting area without overlying portion of the etching barrier resin layer is selectively disconnected by etching using the dielectric layer and the etching barrier resin as a mask.

公开(公告)号：US07838951B2

公开(公告)日：2010-11-23

申请号：US12109101

申请日：2008-04-24

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: H01L29/78 ,  H01L21/00

CPC classification number: G01P15/123 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/084

Abstract: A semiconductor sensor and a manufacturing method of the same capable of making the specific gravity of a weight part to be greater than that of a weight part made of semiconductor material only is disclosed. The semiconductor sensor includes the weight part, a supporting part, a flexible part, and plural piezoresistive elements. The weight part includes a weight part photosensitive resin layer made of photosensitive resin in which metal particles are included. The supporting part surrounds and is separated from the weight part. The flexible part is provided between the weight part and the supporting part to support the weight part. The flexible part includes a flexible part semiconductor layer where the plural piezoresistive elements are formed. This configuration allows the specific gravity of the weight part photosensitive resin layer greater than that of the weight part semiconductor layer due to the metal particles.

Abstract translation: 公开了一种半导体传感器及其制造方法，其能够使重量部分的比重大于仅由半导体材料制成的重量部件的比重。 半导体传感器包括重量部分，支撑部分，柔性部分和多个压阻元件。 重量部分包括由包含金属颗粒的感光树脂制成的重量份感光性树脂层。 支撑部分包围并与重物部分分离。 柔性部分设置在重量部分和支撑部分之间以支撑重物部分。 柔性部件包括形成多个压电元件的柔性部件半导体层。 这种构造使得由于金属颗粒，重量部分感光性树脂层的比重大于重量部分半导体层的比重。

公开(公告)号：US07398684B2

公开(公告)日：2008-07-15

申请号：US11369283

申请日：2006-03-06

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: G01P15/08

CPC classification number: G01P15/123 ,  G01P15/0802

Abstract: A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.

Abstract translation: 公开了一种半导体传感器，其包括至少包括半导体层的衬底。 基板包括在基板中心附近的重量配置部分，围绕配重部分的柔性部分和设置在柔性部分周围的支撑部分。 半导体传感器还包括布置在配重部分上的重物。 重量由与重量配置部分和柔性部分不同的材料制成。

公开(公告)号：US20070240510A1

公开(公告)日：2007-10-18

申请号：US11369283

申请日：2006-03-06

Applicant: Kazunari Kimino

Inventor： Kazunari Kimino

IPC: G01P15/12 ,  H01L21/00

CPC classification number: G01P15/123 ,  G01P15/0802

Abstract: A semiconductor sensor is disclosed that includes a substrate including at least a semiconductor layer. The substrate includes a weight arranging part in the vicinity of the center of the substrate, a flexible part around the weight arranging part, and supporting parts provided around the flexible part. The semiconductor sensor further includes a weight arranged on the weight arranging part. The weight is made of a material different from that of the weight arranging part and the flexible parts.

Abstract translation: 公开了一种半导体传感器，其包括至少包括半导体层的衬底。 基板包括在基板中心附近的重量配置部分，围绕配重部分的柔性部分和设置在柔性部分周围的支撑部分。 半导体传感器还包括布置在配重部分上的重物。 重量由与重量配置部分和柔性部分不同的材料制成。