发明授权
- 专利标题: Compliant multi-composition interconnects
- 专利标题(中): 符合多组合互连
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申请号: US10832178申请日: 2004-04-26
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公开(公告)号: US07400041B2公开(公告)日: 2008-07-15
- 发明人: Sriram Muthukumar , Thomas S. Dory
- 申请人: Sriram Muthukumar , Thomas S. Dory
- 代理机构: Schwabe Williamson & Wyatt
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
A compliant interconnect with two or more layers of metal of two or more compositions with internal stresses is described herein.
公开/授权文献
- US20050239275A1 Compliant multi-composition interconnects 公开/授权日:2005-10-27