发明授权
- 专利标题: Laser processing method and processing device
- 专利标题(中): 激光加工方法和加工装置
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申请号: US11598708申请日: 2006-11-14
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公开(公告)号: US07402772B2公开(公告)日: 2008-07-22
- 发明人: Shiro Hamada , Jiro Yamamoto , Tomoyuki Yamaguchi
- 申请人: Shiro Hamada , Jiro Yamamoto , Tomoyuki Yamaguchi
- 申请人地址: JP Tokyo
- 专利权人: Sumitomo Heavy Industries, Ltd.
- 当前专利权人: Sumitomo Heavy Industries, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Squire, Sanders & Dempsey L.L.P.
- 优先权: JP2002-254015 20020830
- 主分类号: B23K26/38
- IPC分类号: B23K26/38 ; B23K26/067
摘要:
Embodiments of the invention provide a laser processing apparatus and method. The laser processing apparatus includes a holder that holds a processing target, a first laser source that emits pulsed laser beam, and a second laser source that emits continuous-wave laser beam. The apparatus further includes an optical system that transmits the pulsed laser beam from the first laser source and the continuous-wave laser beam from the second laser source on a surface of the processing target held by the holder in such a manner that a beam spot of the pulsed laser beam is included inside a beam spot of the continuous-wave laser beam, and a moving mechanism that moves the beam spots of the pulsed laser beam and the continuous-wave laser beam on the surface of the processing target.
公开/授权文献
- US20070062919A1 Laser processing method and processing device 公开/授权日:2007-03-22
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