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US07402772B2 Laser processing method and processing device 失效
激光加工方法和加工装置

Laser processing method and processing device
摘要:
Embodiments of the invention provide a laser processing apparatus and method. The laser processing apparatus includes a holder that holds a processing target, a first laser source that emits pulsed laser beam, and a second laser source that emits continuous-wave laser beam. The apparatus further includes an optical system that transmits the pulsed laser beam from the first laser source and the continuous-wave laser beam from the second laser source on a surface of the processing target held by the holder in such a manner that a beam spot of the pulsed laser beam is included inside a beam spot of the continuous-wave laser beam, and a moving mechanism that moves the beam spots of the pulsed laser beam and the continuous-wave laser beam on the surface of the processing target.
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