公开(公告)号：US07402772B2

公开(公告)日：2008-07-22

申请号：US11598708

申请日：2006-11-14

申请人： Shiro Hamada ,  Jiro Yamamoto ,  Tomoyuki Yamaguchi

发明人： Shiro Hamada ,  Jiro Yamamoto ,  Tomoyuki Yamaguchi

IPC分类号： B23K26/38 ,  B23K26/067

CPC分类号： B23K26/0652 ,  B23K26/0622 ,  B23K26/0626 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/0732 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/382 ,  B23K26/40 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50

摘要： Embodiments of the invention provide a laser processing apparatus and method. The laser processing apparatus includes a holder that holds a processing target, a first laser source that emits pulsed laser beam, and a second laser source that emits continuous-wave laser beam. The apparatus further includes an optical system that transmits the pulsed laser beam from the first laser source and the continuous-wave laser beam from the second laser source on a surface of the processing target held by the holder in such a manner that a beam spot of the pulsed laser beam is included inside a beam spot of the continuous-wave laser beam, and a moving mechanism that moves the beam spots of the pulsed laser beam and the continuous-wave laser beam on the surface of the processing target.

摘要翻译： 本发明的实施例提供一种激光加工装置和方法。 激光加工装置包括保持处理目标的保持器，发射脉冲激光束的第一激光源和发射连续波激光束的第二激光源。 该装置还包括一个光学系统，其将来自第一激光源的脉冲激光束和来自第二激光源的连续波激光束传送到由保持器保持的处理对象的表面上， 脉冲激光束被包括在连续波激光束的光束点内，以及将脉冲激光束和连续波激光束的光束点移动到处理对象的表面上的移动机构。

公开(公告)号：US20060289412A1

公开(公告)日：2006-12-28

申请号：US11514165

申请日：2006-09-01

申请人： Shiro Hamada

发明人： Shiro Hamada

IPC分类号： B23K26/06 ,  B23K26/067

CPC分类号： G03F7/70183 ,  B23K26/067 ,  B23K26/0676 ,  G03F7/70158

摘要： A laser source emits a laser beam. A diffractive optical element is disposed at a position which the laser beam emitted from the laser source is incident on. The diffractive optical element splits the incident laser beam into laser beams. The laser beams are incident on a first zoom lens system. The first zoom lens system focuses the incident laser beams onto a first virtual plane.

摘要翻译： 激光源发射激光束。 衍射光学元件设置在从激光源发射的激光束入射的位置。 衍射光学元件将入射激光束分成激光束。 激光束入射到第一变焦透镜系统上。 第一变焦透镜系统将入射的激光束聚焦到第一虚拟平面上。

公开(公告)号：US20050155956A1

公开(公告)日：2005-07-21

申请号：US11065589

申请日：2005-02-25

申请人： Shiro Hamada ,  Jiro Yamamoto ,  Tomoyuki Yamaguchi

发明人： Shiro Hamada ,  Jiro Yamamoto ,  Tomoyuki Yamaguchi

IPC分类号： B23K26/06 ,  B23K26/08 ,  B23K26/38

CPC分类号： B23K26/0652 ,  B23K26/0622 ,  B23K26/0626 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/0732 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/382 ,  B23K26/40 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50

摘要： Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the pierced hole by a lens to foreman image of the pierced hole of the mask on the surface of the processing target. The laser beam passing through the lens is scanned to move an irradiating position of the laser beam on the surface of the processing target, and the image of the pierced hole of the mask is formed on the surface of the processing target during the scanning for processing the processing target. A high quality laser process can be carried out.

摘要翻译： 通过将透镜穿过穿孔的激光束聚焦到掩模的穿孔的前导图像中，将具有穿孔的掩模的激光束的横截面重整后的激光束照射到处理对象的表面 在加工对象的表面。 扫描通过透镜的激光束，将激光束的照射位置移动到处理对象物的表面，并且在扫描处理期间将掩模的穿孔的图像形成在处理对象的表面上 处理目标。 可以进行高质量的激光加工。

公开(公告)号：US20060243714A1

公开(公告)日：2006-11-02

申请号：US11370895

申请日：2006-03-09

申请人： Shiro Hamada ,  Tomoyuki Yamaguchi ,  Jiro Yamamoto

发明人： Shiro Hamada ,  Tomoyuki Yamaguchi ,  Jiro Yamamoto

IPC分类号： B23K26/38

CPC分类号： B23K26/0608 ,  B23K26/0604 ,  B23K26/361 ,  B23K2103/42 ,  B23K2103/50 ,  C03C15/00 ,  C03C17/42 ,  C03C23/0025 ,  C03C2218/33 ,  G02F1/13439

摘要： A laser processing method has the steps of: (a) irradiating a laser beam from a laser source; and (b) applying the laser beam irradiated from the laser source to a first surface area of a processing object having a resin layer and a transparent conductive layer made of metal oxide and formed on the surface of the resin layer, to remove the transparent conductive layer and form a concave portion exposing the resist layer on the bottom of the first concave portion.

摘要翻译： 激光加工方法具有以下步骤：（a）从激光源照射激光束; 和（b）将从激光源照射的激光束施加到具有树脂层的加工对象的第一表面区域和由金属氧化物制成的透明导电层并形成在树脂层的表面上，以除去透明导电 并形成露出第一凹部的底部上的抗蚀剂层的凹部。

公开(公告)号：US20070062919A1

公开(公告)日：2007-03-22

申请号：US11598708

申请日：2006-11-14

申请人： Shiro Hamada ,  Jiro Yamamoto ,  Tomoyuki Yamaguchi

发明人： Shiro Hamada ,  Jiro Yamamoto ,  Tomoyuki Yamaguchi

IPC分类号： B23K26/38 ,  B23K26/06

CPC分类号： B23K26/0652 ,  B23K26/0622 ,  B23K26/0626 ,  B23K26/0648 ,  B23K26/066 ,  B23K26/0732 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/364 ,  B23K26/382 ,  B23K26/40 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50

摘要： Laser beam is irradiated to a surface of a processing target after reforming a cross section of the laser beam with a mask having a pierced hole by concentrating the laser beam passing through the pierced hole by a lens to form an image of the pierced hole of the mask on the surface of the processing target. The laser beam passing through the lens is scanned to move an irradiating position of the laser beam on the surface of the processing target, and the image of the pierced hole of the mask is formed on the surface of the processing target during the scanning for processing the processing target. A high quality laser process can be carried out.

摘要翻译： 在通过使透镜穿过穿孔的激光束聚焦以形成透镜的穿孔的图像之后，通过具有穿孔的掩模对激光束的横截面进行重整后，将激光束照射到处理对象的表面 掩模在加工对象的表面上。 扫描通过透镜的激光束，将激光束的照射位置移动到处理对象物的表面，并且在扫描处理期间将掩模的穿孔的图像形成在处理对象的表面上 处理目标。 可以进行高质量的激光加工。

公开(公告)号：US06906282B2

公开(公告)日：2005-06-14

申请号：US10181423

申请日：2001-01-09

申请人： Shiro Hamada

发明人： Shiro Hamada

IPC分类号： B23K26/06

CPC分类号： G02B27/0988 ,  B23K26/066 ,  G03F1/20

摘要： A mask 10 comprises a mask member layer 12 having a laser processing pattern and comprising a metallic material and first and second substrate members 11 and 13 holding the mask member on two faces thereof and comprising a material that transmits laser light.

摘要翻译： 掩模10包括具有激光加工图案并且包括金属材料的掩模构件层12和在其两个表面上保持掩模构件的第一和第二基板构件11和13，并且包括透射激光的材料。

公开(公告)号：US06888096B1

公开(公告)日：2005-05-03

申请号：US10088495

申请日：2000-09-25

申请人： Shiro Hamada

发明人： Shiro Hamada

IPC分类号： B23K26/06 ,  B23K26/073 ,  B23K26/38 ,  H05K3/00 ,  B23K26/00

CPC分类号： B23K26/066 ,  B23K26/0738 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  H05K3/0026

摘要： It is provided with a homogeneous optical system 13 for transforming laser light from a laser oscillator 10 into laser light having a linear cross-section and a drive mechanism for synchronously moving a mask 11 and a printed circuit board 12, an irradiation position of the linear laser light being fixed, the drive mechanism moving the mask and the workpiece so that the mask passes through the irradiation position of the laser light while the moving direction thereof is perpendicular to the extending direction of the linear laser light so that the mask is scanned by the linear laser light, the drilling defined by the mask pattern thereby being carried out to the workpiece.

摘要翻译： 设置有用于将来自激光振荡器10的激光转换为具有线性横截面的激光的均匀光学系统13和用于同步移动掩模11和印刷电路板12的驱动机构，线性 激光固定，驱动机构移动掩模和工件，使得掩模通过激光的照射位置，同时其移动方向垂直于线性激光的延伸方向，从而掩模被扫描 线性激光，由掩模图案限定的钻孔从而被执行到工件。

公开(公告)号：US06720524B1

公开(公告)日：2004-04-13

申请号：US10089063

申请日：2002-04-05

申请人： Shiro Hamada

发明人： Shiro Hamada

IPC分类号： B23K2600

CPC分类号： B23K26/0738 ,  B23K26/066 ,  B23K26/073 ,  B23K26/082 ,  B23K26/0821 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  H05K3/0026 ,  H05K2203/0557

摘要： A polygon mirror 11, a mask 12 having a row of holes for defining a processing pattern, a galvano-mirror 16, and a processing lens 17are arranged in that order between a laser oscillator 10 and a printed circuit board 20 as a workpiece, and the laser beam from the laser oscillator 10 is projected onto the printer circuit board 20 traveling through these components. The polygon mirror 11 sweeps the laser beam so that the laser beam scans the holes of the mask 12 for the mirror on each face, and a plurality of holes are thereby formed into the printed circuit board 20. The irradiation region of the laser beam to the printer circuit board 20 is shifted in one axis direction by the galvano-mirror 16.

摘要翻译： 在激光振荡器10和作为工件的印刷电路板20之间依次配置有多面镜11，具有用于界定处理图案的一排孔的掩模12，电流镜16和处理透镜17， 来自激光振荡器10的激光束被投影到穿过这些部件的打印机电路板20上。 多面镜11扫描激光束，使得激光束扫描每个面上的镜子的掩模12的孔，并且由此形成多个孔到印刷电路板20中。激光束的照射区域 打印机电路板20通过电流镜16在一个轴向移动。

公开(公告)号：US5730924A

公开(公告)日：1998-03-24

申请号：US578960

申请日：1995-12-27

申请人： Takanori Katoh ,  Yanping Zhang ,  Shiro Hamada

发明人： Takanori Katoh ,  Yanping Zhang ,  Shiro Hamada

IPC分类号： B29C35/08 ,  B29C59/16 ,  G03F7/039 ,  G03F7/20 ,  C08J7/00 ,  B29C71/04

CPC分类号： B29C59/16 ,  G03F7/039 ,  G03F7/2002 ,  B29C2035/0827 ,  B29K2027/18

摘要： A method of micromachining polytetrafluoroethylene by applying radiation light to the surface of polytetrafluoroethylene, includes the steps of: preparing a workpiece including a region made of polytetrafluoroethylene; preparing a mask having patterned areas substantially transmitting and not transmitting the radiation light; and applying the radiation light containing at least ultraviolet rays of a wavelength of 160 nm to a surface of the workpiece through the mask. Polytetrafluoroethylene can be microscopically processed, while obtaining a high aspect ratio and processing a large area with ease.

摘要翻译： 通过对聚四氟乙烯的表面施加辐射光来微加工聚四氟乙烯的方法包括以下步骤：制备包括由聚四氟乙烯制成的区域的工件; 制备具有基本上透射并且不透射辐射光的图案区域的掩模; 以及通过所述掩模将至少包含波长为160nm的紫外线的辐射光施加到所述工件的表面。 可以对聚四氟乙烯进行显微加工，同时获得高的纵横比并容易地加工大面积。