发明授权
- 专利标题: Power module structure and solid state relay using same
- 专利标题(中): 电源模块结构和固态继电器使用相同
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申请号: US11607152申请日: 2006-11-30
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公开(公告)号: US07403395B2公开(公告)日: 2008-07-22
- 发明人: Takashi Fujimoto , Hiroto Nagaishi , Shoichi Konagata
- 申请人: Takashi Fujimoto , Hiroto Nagaishi , Shoichi Konagata
- 申请人地址: JP Kyoto
- 专利权人: OMRON Corporation
- 当前专利权人: OMRON Corporation
- 当前专利权人地址: JP Kyoto
- 代理机构: Weaver Austin Villeneuve & Sampson LLP
- 优先权: JPP2005-360018 20051214
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.
公开/授权文献
- US20070134976A1 Power module structure and solid state relay using same 公开/授权日:2007-06-14