公开(公告)号：US07403395B2

公开(公告)日：2008-07-22

申请号：US11607152

申请日：2006-11-30

申请人： Takashi Fujimoto ,  Hiroto Nagaishi ,  Shoichi Konagata

发明人： Takashi Fujimoto ,  Hiroto Nagaishi ,  Shoichi Konagata

IPC分类号： H05K7/20

CPC分类号： H01L23/492 ,  H01L23/367 ,  H01L23/3677 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.

摘要翻译： 功率模块结构具有用于接触散热器的加热板，焊接到加热板的绝缘板，焊接到绝缘板的端子和具有与端子对应的接触点的半导体芯片，以便通过该端子与端子接触 接触点。 端子设置有减震部件，其用于削弱由于端子和绝缘板之间的热膨胀系数的差异而产生的力。 端子具有用于限制该力的力限制部，并局部形成为端子焊接到绝缘板的焊接区域。 这种结构被包含在基座内并且与散热器进行表面接触以形成固态继电器。

公开(公告)号：US20070134976A1

公开(公告)日：2007-06-14

申请号：US11607152

申请日：2006-11-30

申请人： Takashi Fujimoto ,  Hiroto Nagaishi ,  Shoichi Konagata

发明人： Takashi Fujimoto ,  Hiroto Nagaishi ,  Shoichi Konagata

IPC分类号： H01R12/24

CPC分类号： H01L23/492 ,  H01L23/367 ,  H01L23/3677 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module structure has a heat plate for contacting a heat sink, an insulating plate soldered to the heat plate, a terminal soldered to the insulating plate and a semiconductor chip having a contact point corresponding to the terminal so as to contact the terminal through this contact point. The terminal is provided with a shock absorbing part that serves to weaken the force generated due to the difference in coefficient of thermal expansion between the terminal and the insulating plate. The terminal has a force restricting part that serves to restrict this force and is locally formed as a soldering area through which the terminal is soldered to the insulating plate. Such a structure is contained inside a base and makes a surface-contact with a heat sink to form a solid state relay.

摘要翻译： 功率模块结构具有用于接触散热器的加热板，焊接到加热板的绝缘板，焊接到绝缘板的端子和具有与端子对应的接触点的半导体芯片，以便通过该端子与端子接触 接触点。 端子设置有减震部件，其用于削弱由于端子和绝缘板之间的热膨胀系数的差异而产生的力。 端子具有用于限制该力的力限制部，并局部形成为端子焊接到绝缘板的焊接区域。 这种结构被包含在基座内并且与散热器进行表面接触以形成固态继电器。