Invention Grant
- Patent Title: Polyurethane resin-based material for slush molding
- Patent Title (中): 用于搪塑的聚氨酯树脂基材料
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Application No.: US10510905Application Date: 2003-04-08
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Publication No.: US07405257B2Publication Date: 2008-07-29
- Inventor: Shinya Fujibayashi , Hideki Omori , Shogo Nishioka , Shigeto Takeuchi , Mahito Nomura
- Applicant: Shinya Fujibayashi , Hideki Omori , Shogo Nishioka , Shigeto Takeuchi , Mahito Nomura
- Applicant Address: JP Kyoto JP Toyota
- Assignee: Sanyo Chemical Industries, Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Sanyo Chemical Industries, Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Kyoto JP Toyota
- Agency: Edwards Angell Palmer & Dodge LLP
- Priority: JP2002-108466 20020410; JP2002-108467 20020410; JP2002-226743 20020802; JP2003-099710 20030402
- International Application: PCT/JP03/04469 WO 20030408
- International Announcement: WO03/085023 WO 20031016
- Main IPC: C08L75/08
- IPC: C08L75/08

Abstract:
The present invention provides a material for slush molding which is improved in melt properties during slush molding and is excellent in heat resistance, the material being made up of a thermoplastic polyurethane resin (A) the difference between the softening starting temperature (STi) and the softening ending temperature by TMA being from 0 to 30° C., and STi being 135 to 200° C. The resin (A) has a hard segment with an Mn of 200 to 2000 comprising a diisocyanate having a symmetrical structure, a low molecular-weight diamine having a symmetrical structure, and/or a low molecular-weight diol, the content of which being from 5 to 50 wt %, and a soft segment making up of a high molecular-weight diol with an Mn of 500 to 5000, with the aromatic content being 35 wt % or less and the aromatic ring content x and the urea group content y satisfying −0.1x+2.5≦y≦−0.1x+6.
Public/Granted literature
- US20060045996A1 Polyurethane resin based slush molding material Public/Granted day:2006-03-02
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