Invention Grant
- Patent Title: Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
- Patent Title (中): 含有堆叠半导体芯片的半导体装置及其制造方法
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Application No.: US10951541Application Date: 2004-09-28
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Publication No.: US07405484B2Publication Date: 2008-07-29
- Inventor: Ryosuke Usui , Hideki Mizuhara , Takeshi Nakamura
- Applicant: Ryosuke Usui , Hideki Mizuhara , Takeshi Nakamura
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2003-339123 20030930
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An adhesive film is formed on an electrode film, and a coating film is formed thereon. Nickel, chrome, molybdenum, tungsten, aluminum or an alloy of them is used as a constituent material of the adhesive film. Gold, silver, platinum or an alloy of them is used as a constituent material of the coating film.
Public/Granted literature
- US20050067686A1 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof Public/Granted day:2005-03-31
Information query
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