发明授权
- 专利标题： Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
- 专利标题（中）： 用于在半导体器件制造期间传导导电片的方法和装置
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申请号： US11095943申请日： 2005-03-31
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公开(公告)号： US07407081B2公开(公告)日： 2008-08-05
- 发明人: Michael R. Rice , Claes H. Bjorkman , Jun Zhao , Kenneth S. Collins , Thomas Miu
- 申请人： Michael R. Rice , Claes H. Bjorkman , Jun Zhao , Kenneth S. Collins , Thomas Miu
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dugan & Dugan
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23Q16/00
摘要：
In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.
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