公开(公告)号：US20080283387A1

公开(公告)日：2008-11-20

申请号：US12185772

申请日：2008-08-04

申请人： Michael R. Rice ,  Claes H. Bjorkman ,  Jun Zhao ,  Kenneth S. Collins ,  Thomas Miu

发明人： Michael R. Rice ,  Claes H. Bjorkman ,  Jun Zhao ,  Kenneth S. Collins ,  Thomas Miu

IPC分类号： C23C14/34

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/10212 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2224/05599

摘要： In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种用于将导电片传送到目标衬底的电极焊盘的可编程传送装置。 可编程转移装置包括（1）转移基板; 和（2）形成在转印基板上的多个可单独寻址的电极。 每个电极适于在将导电片传送到目标衬底的电极焊盘的过程中选择性地吸引和保持导电片。 提供了许多其他方面。

公开(公告)号：US07407081B2

公开(公告)日：2008-08-05

申请号：US11095943

申请日：2005-03-31

申请人： Michael R. Rice ,  Claes H. Bjorkman ,  Jun Zhao ,  Kenneth S. Collins ,  Thomas Miu

发明人： Michael R. Rice ,  Claes H. Bjorkman ,  Jun Zhao ,  Kenneth S. Collins ,  Thomas Miu

IPC分类号： B23K1/00 ,  B23Q16/00

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L21/67144 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/11 ,  H01L24/742 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K2201/10212 ,  H05K2203/0338 ,  H05K2203/041 ,  H01L2924/00 ,  H01L2224/05599

摘要： In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

摘要翻译： 在第一方面，提供了一种用于将导电片传送到目标衬底的电极焊盘的可编程传送装置。 可编程转移装置包括（1）转移基板; 和（2）形成在转印基板上的多个可单独寻址的电极。 每个电极适于在将导电片传送到目标衬底的电极焊盘的过程中选择性地吸引和保持导电片。 提供了许多其他方面。

公开(公告)号：US20130045570A1

公开(公告)日：2013-02-21

申请号：US13399638

申请日：2012-02-17

申请人： Klaus Schuegraf ,  Seshadri Ramaswami ,  Michael R. Rice ,  Mohsen S. Salek ,  Claes H. Bjorkman

发明人： Klaus Schuegraf ,  Seshadri Ramaswami ,  Michael R. Rice ,  Mohsen S. Salek ,  Claes H. Bjorkman

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/30 ,  H01L21/302 ,  H01L21/308 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67017 ,  H01L21/67207 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate.

摘要翻译： 单片化多个半导体管芯的方法包括提供载体衬底并将半导体衬底接合到载体衬底。 半导体衬底包括多个器件。 该方法还包括在半导体衬底上形成掩模层，将掩模层的预定部分暴露于光，以及处理掩模层的预定部分以在半导体衬底上形成预定的掩模图案。 所述方法还包括形成所述多个半导体管芯，所述多个半导体管芯中的每一个与所述预定掩模图案相关联并且包括所述多个器件中的一个或多个并且将所述多个半导体管芯与所述载体衬底分离。

公开(公告)号：US08580615B2

公开(公告)日：2013-11-12

申请号：US13399638

申请日：2012-02-17

申请人： Klaus Schuegraf ,  Seshadri Ramaswami ,  Michael R. Rice ,  Mohsen S. Salek ,  Claes H. Bjorkman

发明人： Klaus Schuegraf ,  Seshadri Ramaswami ,  Michael R. Rice ,  Mohsen S. Salek ,  Claes H. Bjorkman

IPC分类号： H01L21/00 ,  H01L21/66 ,  G01R31/26

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/30 ,  H01L21/302 ,  H01L21/308 ,  H01L21/561 ,  H01L21/568 ,  H01L21/67017 ,  H01L21/67207 ,  H01L21/6836 ,  H01L23/544 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

摘要： A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate.

摘要翻译： 单片化多个半导体管芯的方法包括提供载体衬底并将半导体衬底接合到载体衬底。 半导体衬底包括多个器件。 该方法还包括在半导体衬底上形成掩模层，将掩模层的预定部分暴露于光，以及处理掩模层的预定部分以在半导体衬底上形成预定的掩模图案。 所述方法还包括形成所述多个半导体管芯，所述多个半导体管芯中的每一个与所述预定掩模图案相关联并且包括所述多个器件中的一个或多个并且将所述多个半导体管芯与所述载体衬底分离。

公开(公告)号：US20180374684A1

公开(公告)日：2018-12-27

申请号：US16015074

申请日：2018-06-21

申请人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice ,  Yue Guo

发明人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice ,  Yue Guo

IPC分类号： H01J37/32 ,  H01L21/02 ,  C23C16/455

摘要： A plasma reactor includes a chamber body having an interior space that provides a plasma chamber, a gas distributor, a pump coupled to the plasma chamber, a workpiece support to hold a workpiece, an intra-chamber electrode assembly comprising a plurality of filaments extending laterally through the plasma chamber, each filament including a conductor surrounded by a cylindrical insulating shell, the plurality of filaments including a first multiplicity of filaments and a second multiplicity of filaments arranged in an alternating pattern with the first multiplicity of filaments, a first bus coupled to the first multiplicity of filaments and a second bus coupled to the second multiplicity of filaments, an RF power source to apply RF signal the intra-chamber electrode assembly, and at least one RF switch configured to controllably electrically couple and decouple the first bus from one of i) ground, ii) the RF power source, or iii) the second bus.

公开(公告)号：US20180308667A1

公开(公告)日：2018-10-25

申请号：US15960342

申请日：2018-04-23

申请人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Yue Guo ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice

发明人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Yue Guo ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice

IPC分类号： H01J37/32 ,  C23C16/455

CPC分类号： H01J37/32568 ,  C23C16/45536 ,  C23C16/45544 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32715 ,  H01J2237/1825 ,  H01J2237/327 ,  H01J2237/3323 ,  H01J2237/3344 ,  H01L21/67069

摘要： A plasma reactor includes a chamber body having an interior space that provides a plasma chamber, a gas distributor to deliver a processing gas to the plasma chamber, a pump coupled to the plasma chamber to evacuate the chamber, a workpiece support to hold a workpiece, and an intra-chamber electrode assembly that includes a plurality of filaments extending laterally through the plasma chamber between a ceiling of the plasma chamber and the workpiece support. Each filament including a conductor surrounded by a cylindrical insulating shell. The plurality of filaments includes a first multiplicity of filaments and a second multiplicity of filaments arranged in an alternating pattern with the first multiplicity of filaments. An RF power source is configured to apply a first RF input signal to the first multiplicity of filaments.

公开(公告)号：US07967996B2

公开(公告)日：2011-06-28

申请号：US11801409

申请日：2007-05-08

申请人： Kenneth S. Collins ,  Hiroji Hanawa ,  Andrew Nguyen ,  Shahid Rauf ,  Ajit Balakrishna ,  Valentin N. Todorow ,  Kartik Ramaswamy ,  Martin Jeffrey Salinas ,  Imad Yousif ,  Walter R. Merry ,  Ying Rui ,  Michael R. Rice

发明人： Kenneth S. Collins ,  Hiroji Hanawa ,  Andrew Nguyen ,  Shahid Rauf ,  Ajit Balakrishna ,  Valentin N. Todorow ,  Kartik Ramaswamy ,  Martin Jeffrey Salinas ,  Imad Yousif ,  Walter R. Merry ,  Ying Rui ,  Michael R. Rice

IPC分类号： B44C1/22

CPC分类号： B08B7/00 ,  B08B7/0035 ,  H01J37/32357 ,  H01J37/3244 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/0209 ,  H01L21/67069 ,  H01L21/67115 ,  H01L21/68764

摘要： A process is provided for removing polymer from a backside of a workpiece and/or photoresist from a front side of the workpiece. For backside polymer removal, the wafer is positioned near the ceiling to above a localized or remote plasma source having a side outlet through the sidewall of the chamber, and backside polymer is removed by rotating the workpiece while flowing plasma by-products from the side outlet to the wafer backside. For front side photoresist removal, the wafer is positioned away from the ceiling and below the side outlet of the localized plasma source, and front side photoresist is remove by rotating the workpiece while flowing plasma by-products from the side outlet to the wafer front side.

摘要翻译： 提供了用于从工件的前侧从工件和/或光致抗蚀剂的背面去除聚合物的方法。 对于背面聚合物去除，晶片位于天花板附近，位于具有通过室的侧壁的侧出口的局部或远程等离子体源的上方，并且通过在从侧面出口流动等离子体副产物的同时旋转工件来去除背面聚合物 到晶圆背面。 对于前侧光致抗蚀剂去除，晶片远离天花板并位于局部等离子体源的侧出口下方，并且通过在从侧出口流到晶片正面的等离子体副产物流动的同时旋转工件来除去前侧光致抗蚀剂 。

公开(公告)号：US20080179291A1

公开(公告)日：2008-07-31

申请号：US11801409

申请日：2007-05-08

申请人： Kenneth S. Collins ,  Hiroji Hanawa ,  Andrew Nguyen ,  Shahid Rauf ,  Ajit Balakrishna ,  Valentin N. Todorow ,  Kartik Ramaswamy ,  Martin Jeffrey Salinas ,  Imad Yousif ,  Walter R. Merry ,  Ying Rui ,  Michael R. Rice

发明人： Kenneth S. Collins ,  Hiroji Hanawa ,  Andrew Nguyen ,  Shahid Rauf ,  Ajit Balakrishna ,  Valentin N. Todorow ,  Kartik Ramaswamy ,  Martin Jeffrey Salinas ,  Imad Yousif ,  Walter R. Merry ,  Ying Rui ,  Michael R. Rice

IPC分类号： C23F1/00

CPC分类号： B08B7/00 ,  B08B7/0035 ,  H01J37/32357 ,  H01J37/3244 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/0209 ,  H01L21/67069 ,  H01L21/67115 ,  H01L21/68764

摘要： A process is provided for removing polymer from a backside of a workpiece and/or photoresist from a front side of the workpiece. For backside polymer removal, the wafer is positioned near the ceiling to above a localized or remote plasma source having a side outlet through the sidewall of the chamber, and backside polymer is removed by rotating the workpiece while flowing plasma by-products from the side outlet to the wafer backside. For front side photoresist removal, the wafer is positioned away from the ceiling and below the side outlet of the localized plasma source, and front side photoresist is remove by rotating the workpiece while flowing plasma by-products from the side outlet to the wafer front side.

摘要翻译： 提供了用于从工件的前侧从工件和/或光致抗蚀剂的背面去除聚合物的方法。 对于背面聚合物去除，晶片位于天花板附近，位于具有通过室的侧壁的侧出口的局部或远程等离子体源的上方，并且通过在从侧面出口流动等离子体副产物的同时旋转工件来去除背面聚合物 到晶圆背面。 对于前侧光致抗蚀剂去除，晶片远离天花板并位于局部等离子体源的侧出口下方，并且通过在从侧出口流到晶片正面的等离子体副产物流动的同时旋转工件来除去前侧光致抗蚀剂 。

公开(公告)号：US20180308663A1

公开(公告)日：2018-10-25

申请号：US15960372

申请日：2018-04-23

申请人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Yue Guo ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice

发明人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Yue Guo ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice

IPC分类号： H01J37/32 ,  C23C16/455

CPC分类号： H01J37/32137 ,  C23C16/45536 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32715 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/6831

摘要： A plasma reactor includes a chamber body having an interior space that provides a plasma chamber, a gas distributor to deliver a processing gas to the plasma chamber, a pump coupled to the plasma chamber to evacuate the chamber, a workpiece support to hold a workpiece, an intra-chamber electrode assembly including a plurality of filaments extending laterally through the plasma chamber between a ceiling of the plasma chamber and the workpiece support, each filament including a conductor surrounded by a cylindrical insulating shell, and an RF power source configured to apply a first RF signal to at least some of the plurality of filaments, to apply a second RF signal of equal frequency to at least some of the plurality of filaments, and to modulate a phase offset between the first RF signal and the second RF signal.

公开(公告)号：US20180308664A1

公开(公告)日：2018-10-25

申请号：US15960382

申请日：2018-04-23

申请人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Yue Guo ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice

发明人： Kenneth S. Collins ,  Kartik Ramaswamy ,  Yue Guo ,  Shahid Rauf ,  Kallol Bera ,  James D. Carducci ,  Michael R. Rice

IPC分类号： H01J37/32 ,  C23C16/455

CPC分类号： H01J37/32183 ,  C23C16/4554 ,  H01J37/32091 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32568 ,  H01J37/32715 ,  H01J2237/1825 ,  H01J2237/3321 ,  H01J2237/3323 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/6831

摘要： A plasma reactor includes a chamber body having an interior space that provides a plasma chamber, a gas distributor to deliver a processing gas to the plasma chamber, a pump coupled to the plasma chamber to evacuate the chamber, a workpiece support to hold a workpiece, and an intra-chamber electrode assembly including a plurality of filaments extending laterally through the plasma chamber between a ceiling of the plasma chamber and the workpiece support. At least one bus is electrically connected to a conductor of each filament. An RF power source is configured to apply a first RF signal of a first frequency to the plurality of filaments at a first location on at least one bus, and to apply a second RF signal of different second frequency to the plurality of filaments at a different second location on the at least one bus.