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US07410909B2 Method of removing ion implanted photoresist 失效
去除离子注入光刻胶的方法

Method of removing ion implanted photoresist
Abstract:
A method of removing an ion implanted photoresist comprises performing first cleaning a semiconductor substrate having the ion implanted photoresist using hot deionized water to which a megasonic process is applied, first rinsing the semiconductor substrate using cold deionized water, drying the semiconductor substrate, removing the ion implanted photoresist, and second cleaning the semiconductor wafer using an SPM solution.
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