Invention Grant
- Patent Title: Method of managing wafer defects
- Patent Title (中): 晶圆缺陷管理方法
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Application No.: US10711310Application Date: 2004-09-09
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Publication No.: US07412090B2Publication Date: 2008-08-12
- Inventor: Hung-En Tai , Chia-Yun Chen , Sheng-Jen Wang
- Applicant: Hung-En Tai , Chia-Yun Chen , Sheng-Jen Wang
- Applicant Address: TW Hsin-Chu
- Assignee: Powerchip Semiconductor Corp.
- Current Assignee: Powerchip Semiconductor Corp.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: G06K9/00
- IPC: G06K9/00

Abstract:
A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.
Public/Granted literature
- US20060050950A1 Method of Managing Wafer Defects Public/Granted day:2006-03-09
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