公开(公告)号：US07079677B2

公开(公告)日：2006-07-18

申请号：US10249148

申请日：2003-03-19

Applicant: Hung-En Tai ,  Sheng-Jen Wang

Inventor： Hung-En Tai ,  Sheng-Jen Wang

IPC: G06K9/00 ,  G06K9/36

CPC classification number: G06Q10/04 ,  G05B2219/32191 ,  G05B2219/45031 ,  H01L21/67276 ,  Y02P90/22

Abstract: An automatic intelligent yield improving and process parameter multivariate analysis system and the analysis method thereof. The system is applied to a computer to set up analysis procedures for analyzing process parameters obtained from each measuring machine in semiconductor testing process by utilizing data mining technology. The system includes a plurality of semiconductor processing nodes having different functions. The system links each of the semiconductor processing node to another semiconductor processing node by a logic means so that the computer can process the semiconductor processing nodes sequentially. The system also links the semiconductor processing nodes by a data connection means to allow microprocessors to load necessary parameter data or wafer lot numbers from corresponding semiconductor processing nodes by a data connection means.

Abstract translation: 一种自动智能产量提高和过程参数多变量分析系统及其分析方法。 该系统应用于计算机，通过利用数据挖掘技术，在半导体测试过程中设置分析从每台测量机获得的工艺参数的分析程序。 该系统包括具有不同功能的多个半导体处理节点。 该系统通过逻辑装置将每个半导体处理节点连接到另一个半导体处理节点，使得计算机可以顺序地处理半导体处理节点。 该系统还通过数据连接装置连接半导体处理节点，以允许微处理器通过数据连接装置从相应的半导体处理节点加载必要的参数数据或晶片批号。

公开(公告)号：US20050203858A1

公开(公告)日：2005-09-15

申请号：US10708572

申请日：2004-03-11

Applicant: Hung-En Tai ,  Chien-Chung Chen ,  Sheng-Jen Wang

Inventor： Hung-En Tai ,  Chien-Chung Chen ,  Sheng-Jen Wang

IPC: G06F19/00 ,  G21C17/00

CPC classification number: H01L22/20 ,  G05B19/41875 ,  G06Q30/0283 ,  Y02P90/22

Abstract: A method and related system for semiconductor equipment prevention maintenance management. The method includes recording process parameters of each piece of equipment, recording equipment parameters when each piece of equipment is processing, evaluating and recording time and cost of prevention maintenance after each piece of equipment runs prevention maintenance, evaluating the quality of semiconductor products, and analyzing a relationship between the corresponding process parameter, the corresponding equipment parameters, prevention maintenance cost, and semiconductor products of each piece of equipment.

Abstract translation: 一种半导体设备预防维护管理方法及相关系统。 该方法包括记录每件设备的工艺参数，每台设备的加工记录设备参数，每台设备运行后的预防维护的评估和记录时间和成本预防维护，半导体产品的质量评估和分析 相应的过程参数，相应的设备参数，预防维护成本以及每件设备的半导体产品之间的关系。

公开(公告)号：US06807454B2

公开(公告)日：2004-10-19

申请号：US10249103

申请日：2003-03-17

Applicant: Sheng-Jen Wang ,  Long-Hui Lin

Inventor： Sheng-Jen Wang ,  Long-Hui Lin

IPC: G06F1900

CPC classification number: H01L21/67288 ,  G05B19/41875 ,  G05B2219/32189 ,  G05B2219/32207 ,  G05B2219/32222 ,  Y02P90/14 ,  Y02P90/22

Abstract: A method for automatically controlling defect-specification in a semiconductor manufacturing process is provided. The method provides a module to detect a position, number, size, and intensity signals of defects on a processed patterned wafer. The module further compares the patterned wafer with a normal wafer to preliminarily classify the patterned wafer and creates a defect map. Then, a defect management system is provided to execute a spatial pattern recognition procedure to determine whether or not the corresponding special pattern can be recognized. Finally, messages will be automatically sent by the defect management system to inform related e-mail accounts according to results of the recognition of the special pattern.

Abstract translation: 提供了一种在半导体制造过程中自动控制缺陷规格的方法。 该方法提供了一种模块，用于检测经处理的图案化晶片上的缺陷的位置，数量，尺寸和强度信号。 该模块进一步将图案化晶片与正常晶片进行比较，以对图案化晶片进行初步分类并创建缺陷图。 然后，提供缺陷管理系统来执行空间模式识别过程，以确定是否可以识别对应的特殊模式。 最后，消息将由缺陷管理系统自动发送，以根据特殊模式的识别结果通知相关的电子邮件帐户。

公开(公告)号：US09497466B2

公开(公告)日：2016-11-15

申请号：US13304372

申请日：2011-11-24

Applicant: Chia-Yun Cheng ,  Sheng-Jen Wang ,  Yun-Feng Tseng ,  Jun Cui

Inventor： Chia-Yun Cheng ,  Sheng-Jen Wang ,  Yun-Feng Tseng ,  Jun Cui

IPC: G06F3/00 ,  H04N19/129 ,  H04N19/176 ,  H04N19/174 ,  H04N19/44 ,  H04N19/423 ,  H04N19/436 ,  G06F13/38 ,  H04L12/861 ,  G06F5/10

CPC classification number: H04N19/129 ,  G06F5/10 ,  G06F13/385 ,  H04L49/90 ,  H04N19/174 ,  H04N19/176 ,  H04N19/423 ,  H04N19/436 ,  H04N19/44

Abstract: An exemplary buffering apparatus for buffering a multi-partition video/image bitstream which transmits a plurality of compressed frames each having a plurality of partitions includes a first bitstream buffer and a second bitstream buffer. The first bitstream buffer is arranged to buffer data of a first partition of the partitions of a specific compressed frame. The second bitstream buffer is arranged to buffer data of a second partition of the partitions of the specific compressed frame.

Abstract translation: 用于缓冲发送多个具有多个分区的多个压缩帧的多分区视频/图像比特流的示例性缓冲装置包括第一比特流缓冲器和第二比特流缓冲器。 第一比特流缓冲器被布置为缓冲特定压缩帧的分区的第一分区的数据。 第二比特流缓冲器被布置为缓冲特定压缩帧的分区的第二分区的数据。

公开(公告)号：US07412090B2

公开(公告)日：2008-08-12

申请号：US10711310

申请日：2004-09-09

Applicant: Hung-En Tai ,  Chia-Yun Chen ,  Sheng-Jen Wang

Inventor： Hung-En Tai ,  Chia-Yun Chen ,  Sheng-Jen Wang

IPC: G06K9/00

CPC classification number: G01N21/9501

Abstract: A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.

Abstract translation: 管理晶片缺陷的方法包括检查晶片中的每个芯片以产生晶片缺陷原始数据的单元，使用服务器来整合晶片缺陷原始数据的单元以产生用于记录位置，类型的晶片缺陷分布数据的单元， 和尺寸的缺陷，使用服务器根据单位晶片缺陷分布数据生成相应的图形文件以显示各种缺陷分布，并将绘图文件发送到终端，使得终端用户可以在不接收到缺陷分布的情况下查看缺陷分布 晶圆缺陷原始数据单位。

公开(公告)号：US07260444B2

公开(公告)日：2007-08-21

申请号：US11228361

申请日：2005-09-19

Applicant: Chien-Chung Chen ,  Sheng-Jen Wang ,  Yu-Wen Ho

Inventor： Chien-Chung Chen ,  Sheng-Jen Wang ,  Yu-Wen Ho

IPC: G06F19/00

CPC classification number: H01L21/67276 ,  G05B15/02 ,  G05B23/024 ,  G05B2219/1112 ,  G05B2219/45031 ,  G05B2223/02

Abstract: A real-time management method for manufacturing management and yield rate analysis integration. A plurality of yield rates relating to wafer products are summed and averaged for a historical yield rate. Multiple representational inline QC parameters are selected. A statistical process is implemented and, if no extreme value and collinear parameter exists and if analysis results satisfy normal distribution, multiple optimum inline QC parameters are selected from the representational inline QC parameters. Weights of each optimum inline QC parameter are calculated. A predicted yield rate is calculated according to the historical yield rate, weights, and a plurality of measurement and target values relating to the wafer products.

Abstract translation: 制造管理和产出率分析整合的实时管理方法。 将与晶片产品相关的多个屈服率以历史产量率相加和平均。 选择多个代表性的在线QC参数。 实施统计过程，如果没有极值和共线参数存在，并且如果分析结果满足正态分布，则从表示的在线QC参数中选择多个最佳在线QC参数。 计算每个最佳在线QC参数的权值。 根据历史收益率，权重以及与晶片产品相关的多个测量值和目标值来计算预测收益率。

公开(公告)号：US20050187648A1

公开(公告)日：2005-08-25

申请号：US10708277

申请日：2004-02-20

Applicant: Hung-En Tai ,  Chien-Chung Chen ,  Sheng-Jen Wang

Inventor： Hung-En Tai ,  Chien-Chung Chen ,  Sheng-Jen Wang

IPC: G05B19/418 ,  G05B23/02 ,  H01L21/02 ,  G06F19/00

CPC classification number: H01L22/20 ,  G05B2219/32191 ,  Y02P90/22

Abstract: A semiconductor process and yield analysis integrated real-time management method comprises inspecting a plurality of semiconductor products with a plurality of items to generate and record a plurality of inspecting results during semiconductor process, classifying the semiconductor products as a plurality of groups with a default rule to generate and record an initial data in a database, indexing a plurality of semiconductor product groups and the corresponding initial data from the database by a default product rule and parameter to calculate a corresponding analysis result, and displaying the analysis result according to the indexed semiconductor product groups and the initial data.

Abstract translation: 集成实时管理方法的半导体工艺和成品率分析包括在半导体处理期间检查多个半导体产品以产生并记录多个检查结果，并将半导体产品作为具有默认规则的多个组进行分类 在数据库中生成和记录初始数据，通过默认产品规则和参数从数据库索引多个半导体产品组和相应的初始数据，以计算相应的分析结果，并根据索引的半导体显示分析结果 产品组和初始数据。

公开(公告)号：US20060050950A1

公开(公告)日：2006-03-09

申请号：US10711310

申请日：2004-09-09

Applicant: Hung-En Tai ,  Chia-Yun Chen ,  Sheng-Jen Wang

Inventor： Hung-En Tai ,  Chia-Yun Chen ,  Sheng-Jen Wang

IPC: G06K9/00

CPC classification number: G01N21/9501

Abstract: A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.

Abstract translation: 管理晶片缺陷的方法包括检查晶片中的每个芯片以产生晶片缺陷原始数据的单元，使用服务器来整合晶片缺陷原始数据的单元以产生用于记录位置，类型的晶片缺陷分布数据的单元， 和尺寸的缺陷，使用服务器根据单位晶片缺陷分布数据生成相应的图形文件以显示各种缺陷分布，并将绘图文件发送到终端，使得终端用户可以在不接收到缺陷分布的情况下查看缺陷分布 晶圆缺陷原始数据单位。

公开(公告)号：US06531776B2

公开(公告)日：2003-03-11

申请号：US09940852

申请日：2001-08-29

Applicant: Ben Min-Jer Lin ,  Sheng-Jen Wang

Inventor： Ben Min-Jer Lin ,  Sheng-Jen Wang

IPC: H01L2940

CPC classification number: H01L21/7682 ,  H01L21/76885 ,  H01L23/5222 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of forming a semiconductor device having reduced interconnect-line parasitic capacitance is provided. The method includes the following steps. First, a substrate is provided and a plurality of interconnect lines are formed on the substrate. A barrier layer is then formed. Next, the barrier layer is hardened and thinned so as to make the barrier layer having a thin-film attribute. Following that, a separation layer is formed by filling the space between and above the interconnect lines with a dielectric. Then, the dielectric is foamed. After that, an insulating layer is formed. Finally, the dielectric is condensed such that air gaps are formed in the separation layer.

公开(公告)号：US07099729B2

公开(公告)日：2006-08-29

申请号：US10708277

申请日：2004-02-20

Applicant: Hung-En Tai ,  Chien-Chung Chen ,  Sheng-Jen Wang

Inventor： Hung-En Tai ,  Chien-Chung Chen ,  Sheng-Jen Wang

IPC: G06F19/00

CPC classification number: H01L22/20 ,  G05B2219/32191 ,  Y02P90/22

Abstract: A semiconductor process and yield analysis integrated real-time management method comprises inspecting a plurality of semiconductor products with a plurality of items to generate and record a plurality of inspecting results during semiconductor process, classifying the semiconductor products as a plurality of groups with a default rule to generate and record an initial data in a database, indexing a plurality of semiconductor product groups and the corresponding initial data from the database by a default product rule and parameter to calculate a corresponding analysis result, and displaying the analysis result according to the indexed semiconductor product groups and the initial data.

Abstract translation: 集成实时管理方法的半导体工艺和成品率分析包括在半导体处理期间检查多个半导体产品以产生并记录多个检查结果，并将半导体产品作为具有默认规则的多个组进行分类 在数据库中生成和记录初始数据，通过默认产品规则和参数从数据库索引多个半导体产品组和相应的初始数据，以计算相应的分析结果，并根据索引的半导体显示分析结果 产品组和初始数据。