发明授权
- 专利标题： Method for reducing stress between substrates of differing materials
- 专利标题（中）： 减少不同材料的基材之间应力的方法
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申请号： US11059596申请日： 2005-02-16
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公开(公告)号： US07413110B2公开(公告)日： 2008-08-19
- 发明人: Vahid Goudarzi , Julio A. Abdala , Gulten Goudarzi
- 申请人： Vahid Goudarzi , Julio A. Abdala , Gulten Goudarzi
- 申请人地址： US IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： US IL Schaumburg
- 主分类号： B23K31/02
- IPC分类号： B23K31/02
摘要：
A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.