发明授权
US07419911B2 Compositions and methods for rapidly removing overfilled substrates
失效
用于快速去除过度填充底物的组合物和方法
- 专利标题： Compositions and methods for rapidly removing overfilled substrates
- 专利标题（中）： 用于快速去除过度填充底物的组合物和方法
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申请号： US10984820申请日： 2004-11-10
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公开(公告)号： US07419911B2公开(公告)日： 2008-09-02
- 发明人: Philippe H. Chelle , Robert J. Small
- 申请人： Philippe H. Chelle , Robert J. Small
- 申请人地址： US CA Hayward
- 专利权人： EKC Technology, Inc.
- 当前专利权人： EKC Technology, Inc.
- 当前专利权人地址： US CA Hayward
- 代理机构： Morgan Lewis & Bockius LLP
- 主分类号： B08B1/00
- IPC分类号： B08B1/00
摘要：
This invention relates to compositions and methods for removing overfilled substrates, preferably at a relatively high removal rates. Advantageously, a composition according to the invention can contain an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid, and may also optionally contain an abrasive.
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