发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11929387申请日: 2007-10-30
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公开(公告)号: US07420223B2公开(公告)日: 2008-09-02
- 发明人: Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
- 申请人: Sadamu Ishidu , Kenjiro Higaki , Takashi Ishii , Yasushi Tsuzuki
- 申请人地址: JP Osaka
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Darby & Darby
- 优先权: JP2003-069711 20030314
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.
公开/授权文献
- US20080105894A1 SEMICONDUCTOR DEVICE 公开/授权日:2008-05-08