公开(公告)号：US07518155B2

公开(公告)日：2009-04-14

申请号：US10546777

申请日：2004-03-15

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02292 ,  H01L2924/00014 ,  H01L2924/00

摘要： The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation.A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

摘要翻译： 本发明的目的是提供一种发光元件安装构件和使用该发光元件安装构件的半导体装置，其易于处理并且允许充分的散热。 发光元件安装构件200包括：基板2，其包括安装半导体发光元件1的元件安装表面2a和设置在元件安装表面2a上并连接到半导体发光元件1的第一和第二导电区域21,22。 发光元件1; 反射构件6，其包括限定用于容纳半导体发光元件1并且容纳设置在元件安装表面1a上的金属的内部空间6b的反射表面6a; 以及设置在反射面6a上的金属层13。 反射表面6a相对于元件安装表面2a倾斜，使得内部空间6b的直径远离元件安装表面2a。

公开(公告)号：US07420223B2

公开(公告)日：2008-09-02

申请号：US11929387

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 其中L为主面1的长度方向的长度，H为底面2b与元件安装面2a的距离，H / L的比为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。 此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧上，主表面1a设置有凹槽。 凹槽用于防止电极32的连接构件34向外流动。

公开(公告)号：US20080067540A1

公开(公告)日：2008-03-20

申请号：US11929492

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 其中L为主面1的长度方向的长度，H为底面2b与元件安装面2a的距离，H / L的比为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。 此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧，主表面1a设置有凹槽。 凹槽用于防止电极32的连接构件34向外流动。

公开(公告)号：US20060118808A1

公开(公告)日：2006-06-08

申请号：US10539926

申请日：2004-03-08

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 在L表示主表面1a的长度方向上的长度a和H是底面2b与元件安装面2a之间的距离时，H / L的比例为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。

公开(公告)号：US07504671B2

公开(公告)日：2009-03-17

申请号：US11929492

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体装置100配备有基板2，基板2具有底面2b和位于底面2b的相反侧的元件安装面2a，半导体元件1具有安装在元件上的主表面1a 安装面2a。 在L是主表面1的长度方向上的长度，H是底面2b与元件安装面2a的距离的情况下，H / L的比例为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。 此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧，主表面1a设置有凹槽。 凹槽用于防止电极32的连接构件34向外流动。

公开(公告)号：US07335925B2

公开(公告)日：2008-02-26

申请号：US10539926

申请日：2004-03-08

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1a and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 在L表示主表面1a的长度方向上的长度a和H是底面2b与元件安装面2a之间的距离时，H / L的比例为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。

公开(公告)号：US20080105894A1

公开(公告)日：2008-05-08

申请号：US11929387

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

公开(公告)号：US20060198162A1

公开(公告)日：2006-09-07

申请号：US10546777

申请日：2004-03-15

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： F21V7/04 ,  H01J1/62 ,  H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02292 ,  H01L2924/00014 ,  H01L2924/00

摘要： The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

摘要翻译： 本发明的目的是提供一种发光元件安装构件和使用该发光元件安装构件的半导体装置，其易于处理并且允许充分的散热。 发光元件安装构件200包括：基板2，其包括安装半导体发光元件1的元件安装表面2a和设置在元件安装表面2a上并连接到半导体的半导体发光元件1的第一和第二导电区域21,22。 发光元件1; 反射构件6，其包括限定用于容纳半导体发光元件1并容纳设置在元件安装表面1a上的金属的内部空间6b的反射表面6a; 以及设置在反射表面6a上的金属层13。 反射表面6a相对于元件安装表面2a倾斜，使得内部空间6b的直径远离元件安装表面2a。

公开(公告)号：US20090001396A1

公开(公告)日：2009-01-01

申请号：US11987170

申请日：2007-11-28

申请人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

发明人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

IPC分类号： H01L23/52 ,  H01L23/495 ,  H01L33/00

CPC分类号： H01L33/62 ,  H01L23/49827 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09827 ,  H01L2924/00014 ,  H01L2924/00

摘要： A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.

摘要翻译： 集体衬底具有通孔。 通孔各自具有内表面，该内表面包括锥形表面，该锥形表面具有从主表面和外部连接表面朝向最小尺寸孔部分逐渐减小的开口尺寸的锥形。 半导体元件安装件包括从集体基板切出的绝缘构件。 成像装置包括安装在被框架包围的区域中的成像元件，所述框架被结合到绝缘构件的主表面并被盖封闭。 发光二极管部件包括安装在绝缘构件的主表面上的发光元件，通孔的最小孔部分填充有导电材料，发光元件用荧光材料和/ 或保护树脂。

公开(公告)号：US20080203420A1

公开(公告)日：2008-08-28

申请号：US10589747

申请日：2005-07-21

申请人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

发明人： Kenjiro Higaki ,  Daisuke Takagi ,  Sadamu Ishidu ,  Yasushi Tsuzuki

IPC分类号： H01L33/00 ,  H01L23/14 ,  H01L31/0203 ,  H05K1/09

CPC分类号： H01L33/62 ,  H01L23/49827 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09827 ,  H01L2924/00014 ,  H01L2924/00

摘要： A collective substrate (1) is produced by firing a ceramic green sheet and forming through-holes (11) in the resulting substrate. The through-holes (11) each have an interior surface including taper surfaces (11b, 11c) which are tapered as having an opening size progressively decreasing from a main surface (21) and an external connection surface (22) toward a minimum size hole portion (11a). The taper surfaces (11b, 11c) respectively form obtuse angles θ1, θ2 with the main surface (21) and the external connection surface (22). A semiconductor element mount (BL) includes an insulative member (2) cut out of the collective substrate (1). An imaging device (PE2) includes an imaging element (PE1) mounted in a region surrounded by a frame (4) which is bonded to the main surface (21) of the insulative member (2) and closed by a cover (FL). A light emitting diode component (LE2) includes a light emitting element (LE1) mounted on the main surface (21) of the insulative member (2) with the minimum size hole portion (11a) of the through-hole being filled with an electrically conductive material (33a), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE3) includes the light emitting diode component (LE2) mounted in a package (7).

摘要翻译： 通过烧制陶瓷生片并在所得到的衬底中形成通孔（11）来制备集合衬底（1）。 通孔（11）各自具有包括锥形表面（11b，11c）的内表面，该锥形表面（11b，11c）从开口尺寸从主表面（21）和外部连接表面（22）逐渐减小到最小 大小孔部分（11a）。 锥形表面（11b，11c）分别与主表面（21）和外部连接表面（22）分别形成钝角θ1，θ2。 半导体元件安装件（BL）包括从集体基板（1）切出的绝缘构件（2）。 成像装置（PE2）包括安装在由框架（4）包围的区域中的成像元件（PE 1），该框架结合到绝缘构件（2）的主表面（21）并由盖（FL ）。 发光二极管部件（LE2）包括安装在绝缘部件（2）的主表面（21）上的发光元件（LE 1），其中填充有通孔的最小尺寸的孔部分（11a） 用导电材料（33a），发光元件用荧光材料和/或保护树脂（FR）密封。 发光二极管（LE 3）包括安装在封装（7）中的发光二极管部件（LE 2）。