Manufacturing a piezoelectric vibration device, includes: forming a bonding electrode on a part of a piezoelectric substrate to which a cover makes contact; forming a part defining a through hole to the cover so that a profile of an edge of an opening of the through hole at a first surface of the cover is positioned inside an outer shape of the taking out electrode in a plan view when the cover and the piezoelectric substrate are overlapped; forming a first glass film on the first surface of the cover; forming a second glass film on the first surface of the cover; bonding the first glass film to the taking out electrode as well as the second glass film to the bonding electrode by generating an electric field; and cutting an electrical coupling between the taking out electrode and the bonding electrode after step (e).