发明授权
US07422982B2 Method and apparatus for electroprocessing a substrate with edge profile control
失效
用边缘轮廓控制对基底进行电处理的方法和装置
- 专利标题： Method and apparatus for electroprocessing a substrate with edge profile control
- 专利标题（中）： 用边缘轮廓控制对基底进行电处理的方法和装置
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申请号： US11483843申请日： 2006-07-07
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公开(公告)号： US07422982B2公开(公告)日： 2008-09-09
- 发明人: You Wang , Jie Diao , Stan D. Tsai , Lakshmanan Karuppiah
- 申请人： You Wang , Jie Diao , Stan D. Tsai , Lakshmanan Karuppiah
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; H01L21/461
摘要：
A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.
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