公开(公告)号：US09646859B2

公开(公告)日：2017-05-09

申请号：US12771969

申请日：2010-04-30

申请人： Hui Chen ,  Allen L. D'Ambra ,  Sen-Hou Ko ,  Yufei Chen ,  Adrian Blank ,  Mario D. Silvetti ,  Gerald J. Alonzo ,  Lakshmanan Karuppiah

发明人： Hui Chen ,  Allen L. D'Ambra ,  Sen-Hou Ko ,  Yufei Chen ,  Adrian Blank ,  Mario D. Silvetti ,  Gerald J. Alonzo ,  Lakshmanan Karuppiah

IPC分类号： H01L21/67

CPC分类号： H01L21/67046 ,  H01L21/67051

摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.

公开(公告)号：US20130224890A1

公开(公告)日：2013-08-29

申请号：US13774843

申请日：2013-02-22

申请人： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

发明人： Kun Xu ,  Ingemar Carlsson ,  Tzu-Yu Liu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC分类号： H01L21/66

CPC分类号： H01L22/26 ,  B24B37/005 ,  B24B37/04 ,  B24B49/12 ,  H01L22/12

摘要： A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio.

摘要翻译： 控制抛光的方法包括将表示基材的第一区域的间隙时间的比率与基材的第二区域的间隙时间的所需比率进行存储。 在第一衬底的抛光期间，监测上覆层，产生一系列测量，并且对与衬底的第一区域相关联的第一组和与衬底上的第二区域相关联的第二组对第一组进行测量。 基于来自第一组和第二组的测量，分别确定覆盖层被清除的第一次和第二次。 基于在抛光第一基板期间第一区域中施加的第一压力，第一时间，第二时间和期望比率，针对第一区域计算至少一个调整的抛光压力。

公开(公告)号：US20130185884A1

公开(公告)日：2013-07-25

申请号：US13749116

申请日：2013-01-24

申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

IPC分类号： B08B1/00

CPC分类号： B08B1/006 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051

摘要： A method and apparatus for cleaning a substrate are provided. In one embodiment, a particle cleaning module is provided that includes a substrate holder and a pad holder disposed in a housing, and an actuator operable to move the pad holder relative to the substrate holder. The substrate holder is configured to retain and rotate a substrate in a substantially vertical orientation. The pad holder has a pad retaining surface that faces the substrate holder in a parallel and spaced apart relation. The pad holder is rotatable on an axis parallel to an axis on which the substrate holder rotates. The actuator is operable to move the pad holder relative to the substrate holder as to change a distance defined between the first axis and the second axis.

摘要翻译： 提供了一种用于清洁基板的方法和装置。 在一个实施例中，提供了一种颗粒清洁模块，其包括衬底保持器和设置在壳体中的衬垫保持器，以及可操作以相对于衬底保持器移动衬垫保持器的致动器。 衬底保持器被构造成以基本垂直的方向保持和旋转衬底。 焊盘保持器具有以平行和间隔的关系面对衬底保持器的焊盘保持表面。 衬垫支架可以在平行于衬底支架旋转的轴线的轴线上旋转。 致动器可操作以相对于基板保持器移动焊盘保持器，以改变限定在第一轴线和第二轴线之间的距离。

公开(公告)号：US20130111678A1

公开(公告)日：2013-05-09

申请号：US13291945

申请日：2011-11-08

申请人： Hui Chen ,  Allen L. D'Ambra ,  Lakshmanan Karuppiah ,  Thomas H. Osterheld

发明人： Hui Chen ,  Allen L. D'Ambra ,  Lakshmanan Karuppiah ,  Thomas H. Osterheld

IPC分类号： H01L21/02 ,  A46B13/00

CPC分类号： H01L21/67046

摘要： Embodiments of the invention generally relate to a method and apparatus for cleaning a substrate. Particularly, embodiments of the invention relate to an apparatus and method for cleaning a substrate using a scrub brush. One embodiment provides a brush box assembly for cleaning a substrate. The assembly comprises a chamber body having a cleaning chamber disposed therein, a rotatable chuck disposed in the cleaning chamber, and an edge cleaner module positioned adjacent the chuck.

摘要翻译： 本发明的实施例一般涉及一种用于清洁衬底的方法和装置。 特别地，本发明的实施例涉及一种使用擦洗刷清洁衬底的装置和方法。 一个实施例提供了一种用于清洁基底的刷盒组件。 该组件包括一个室主体，其具有设置在其中的清洁室，设置在清洁室中的可旋转卡盘以及邻近卡盘定位的边缘清洁器模块。

公开(公告)号：US08250695B2

公开(公告)日：2012-08-28

申请号：US12573500

申请日：2009-10-05

申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

IPC分类号： A47L25/00

CPC分类号： B08B1/04

摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

公开(公告)号：US20110294400A1

公开(公告)日：2011-12-01

申请号：US13193011

申请日：2011-07-28

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： B24B51/00

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US20110265816A1

公开(公告)日：2011-11-03

申请号：US12771969

申请日：2010-04-30

申请人： Hui Chen ,  Allen L. D'Ambra ,  Sen-Hou Ko ,  Yufei Chen ,  Adrian Blank ,  Mario D. Silvetti ,  Gerald J. Alonzo ,  Lakshmanan Karuppiah

发明人： Hui Chen ,  Allen L. D'Ambra ,  Sen-Hou Ko ,  Yufei Chen ,  Adrian Blank ,  Mario D. Silvetti ,  Gerald J. Alonzo ,  Lakshmanan Karuppiah

IPC分类号： B08B7/00

CPC分类号： H01L21/67046 ,  H01L21/67051

摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using a disk brush. One embodiment provides a substrate cleaner comprising a substrate chuck disposed in the processing volume, and a brush assembly disposed in the processing volume, wherein the brush assembly comprises a disk brush movably disposed opposing the substrate chuck, and a processing surface of the disk brush contacts a surface of the substrate on the substrate chuck.

摘要翻译： 本发明的实施例涉及使用盘刷清洁衬底的装置和方法。 一个实施例提供一种基板清洁器，其包括设置在处理体积中的基板卡盘和设置在处理容积中的刷子组件，其中刷子组件包括可移动地布置成与基板卡盘相对的盘刷，以及盘刷触头的处理表面 基板卡盘上的基板的表面。

公开(公告)号：US20110079245A1

公开(公告)日：2011-04-07

申请号：US12573500

申请日：2009-10-05

申请人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

发明人： Lakshmanan Karuppiah ,  Dan Zhang ,  Simon Yavelberg ,  Jim K. Atkinson ,  Hung Chih Chen ,  Noel Manto ,  Jonathan Domin

IPC分类号： B08B7/00 ,  B08B1/04

CPC分类号： B08B1/04

摘要： Embodiments described herein relate to an apparatus and method for a roller assembly that may be utilized in a brush cleaning module. In one embodiment, a roller assembly is described. The roller assembly includes an annular groove having at least two substantially parallel opposing sidewalls adapted to contact the major surfaces of a substrate along a periphery of the substrate, each of the opposing sidewalls comprising a compressible material having a pre-compressed dimension that is less than a thickness of the periphery of the substrate.

摘要翻译： 本文所述的实施例涉及可用于刷清洁模块中的用于辊组件的装置和方法。 在一个实施例中，描述了辊组件。 辊组件包括具有至少两个基本上平行的相对侧壁的环形凹槽，所述至少两个基本上平行的相对侧壁适于沿着衬底的周边接触衬底的主表面，每个相对的侧壁包括具有预压缩尺寸小于 衬底的周边的厚度。

公开(公告)号：US07746485B2

公开(公告)日：2010-06-29

申请号：US12253160

申请日：2008-10-16

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Jeffrey Drue David ,  Jun Qian ,  Ingemar Carlsson ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Lakshmanan Karuppiah

IPC分类号： G01B11/28

CPC分类号： G01B11/0683 ,  G01B11/0625 ,  Y10S707/99936

摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

公开(公告)号：US20100120333A1

公开(公告)日：2010-05-13

申请号：US12610979

申请日：2009-11-02

申请人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Garrett H. Sin ,  Sanjeev Jain ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/04 ,  H01L21/304 ,  H01L21/66 ,  B24B49/10

CPC分类号： B24B37/013 ,  B24B49/02 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming bare silicon substrates is described. A bare silicon substrate is measured, wherein measuring is performed by a non-contact capacitance measurement device to obtain a signal at a point on the substrate. The signal or a thickness indicated by the signal is communicated to a controller. An adjusted polishing parameter according to the signal or thickness indicated by the signal is determined. After determining an adjusted polishing parameter, the bare silicon substrate is polished on a polisher using the adjusted polishing parameter.

摘要翻译： 描述形成裸硅衬底的方法。 测量裸硅衬底，其中通过非接触电容测量装置进行测量以获得衬底上的点处的信号。 由信号指示的信号或厚度被传送到控制器。 确定根据由信号指示的信号或厚度的调整的抛光参数。 在确定调整的抛光参数之后，使用调整的抛光参数在抛光机上抛光裸硅衬底。