发明授权
- 专利标题： Semiconductor device with increased number of external connection electrodes
- 专利标题（中）： 具有增加外部连接电极数量的半导体器件
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申请号： US11078175申请日： 2005-03-11
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公开(公告)号： US07427812B2公开(公告)日： 2008-09-23
- 发明人: Shinji Wakisaka , Hiroyasu Jobetto
- 申请人： Shinji Wakisaka , Hiroyasu Jobetto
- 申请人地址： JP Tokyo
- 专利权人： Casio Computer Co., Ltd.
- 当前专利权人： Casio Computer Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Frishauf, Holtz, Goodman & Chick, P.C.
- 优先权： JP2004-072265 20040315
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52
摘要：
The semiconductor device of the present invention has a semiconductor substrate having a top surface of a quadrangular shape on which a plurality of connection pads are formed, an insulation film formed on the semiconductor substrate except the connection pads, and a plurality of external connection electrodes formed on the insulation film so as to be connected to the connection pads. The plurality of external connection electrodes constitute at least a first group of external connection electrodes which are arranged on first lines running along each of the two diagonal lines of the semiconductor substrate and second group of external connection electrodes which are arranged on second lines running along the first lines outside the first lines as seen from the diagonal lines.
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