发明授权
- 专利标题： Dicing die-bonding film
- 专利标题（中）： 切片芯片接合薄膜
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申请号： US11947727申请日： 2007-11-29
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公开(公告)号： US07429522B2公开(公告)日： 2008-09-30
- 发明人: Takeshi Matsumura , Masayuki Yamamoto
- 申请人： Takeshi Matsumura , Masayuki Yamamoto
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2003-431690 20031226
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; H01L21/46 ; H01L21/301 ; H01L21/76 ; H01L23/544 ; H01L21/768 ; H01L21/44
摘要：
A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.
公开/授权文献
- US20080088036A1 DICING DIE-BONDING FILM 公开/授权日：2008-04-17
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