公开(公告)号：US20080088036A1

公开(公告)日：2008-04-17

申请号：US11947727

申请日：2007-11-29

申请人： Takeshi Matsumura ,  Masayuki Yamamoto

发明人： Takeshi Matsumura ,  Masayuki Yamamoto

IPC分类号： H01L23/544 ,  H01L21/58

CPC分类号： H01L21/6836 ,  H01L22/20 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00

摘要： A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

摘要翻译： 切割芯片接合膜具有支撑基板，形成在支撑基板上的粘合层，以及形成在粘合剂层上的芯片接合粘合剂层，并且还具有用于识别芯片粘合粘合剂层的位置的标记。 可以提供一种切割芯片接合膜，其中在半导体晶片和切割芯片接合膜彼此粘合的情况下，可以识别膜中的芯片粘合粘合剂层的位置。

公开(公告)号：US20050139973A1

公开(公告)日：2005-06-30

申请号：US11012998

申请日：2004-12-15

申请人： Takeshi Matsumura ,  Masayuki Yamamoto

发明人： Takeshi Matsumura ,  Masayuki Yamamoto

IPC分类号： C09J7/02 ,  C09J201/00 ,  H01L21/301 ,  H01L21/52 ,  H01L21/58 ,  H01L21/66 ,  H01L21/68 ,  H01L23/544 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02

CPC分类号： H01L21/6836 ,  H01L22/20 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00

摘要： A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

摘要翻译： 切割芯片接合膜具有支撑基板，形成在支撑基板上的粘合层，以及形成在粘合剂层上的芯片接合粘合剂层，并且还具有用于识别芯片粘合粘合剂层的位置的标记。 可以提供一种切割芯片接合膜，其中在半导体晶片和切割芯片接合膜彼此粘合的情况下，可以识别膜中的芯片粘合粘合剂层的位置。

公开(公告)号：US6126772A

公开(公告)日：2000-10-03

申请号：US973984

申请日：1997-12-15

申请人： Takayuki Yamamoto ,  Tatsuya Kubozono ,  Yasuo Kihara ,  Yuji Okawa ,  Koichi Hashimoto ,  Takeshi Matsumura ,  Tatsuya Sekido ,  Masayuki Yamamoto ,  Chiaki Harada

发明人： Takayuki Yamamoto ,  Tatsuya Kubozono ,  Yasuo Kihara ,  Yuji Okawa ,  Koichi Hashimoto ,  Takeshi Matsumura ,  Tatsuya Sekido ,  Masayuki Yamamoto ,  Chiaki Harada

IPC分类号： B08B7/00 ,  G03F7/34 ,  G03F7/42 ,  B32B35/00

CPC分类号： H01L21/6836 ,  B08B7/0028 ,  G03F7/346 ,  G03F7/42 ,  G03F7/34 ,  H01L2221/68327 ,  Y10S156/922 ,  Y10T156/11

摘要： An object is to peel off a disused resist from an article, e.g., a silicon wafer, with an adhesive sheet while preventing impurities contained in the adhesive sheet from transferring to the surface of the article, e.g., wafer, and from thus arousing electrical troubles resulting in problems such as decreases in the yield and reliability of the article. A method for resist removal comprising forming an adhesive layer on an article on which a resist is present and peeling the adhesive layer as a united sheet including the resist material from the article, characterized in that the adhesive layer has been regulated so as to have a modulus of elasticity of 1 Kg/mm.sup.2 or higher in the peeling, and an adhesive or an adhesive sheet both for use in the method.

摘要翻译： PCT No.PCT / JP96 / 01621 Sec。 371 1997年12月15日第 102（e）日期1997年12月15日PCT提交1996年6月13日PCT公布。 出版物WO97 / 00534 日期1997年1月3日目的在于，使用粘合片从物品（例如硅晶片）上剥离未使用的抗蚀剂，同时防止粘合片中所含的杂质转移到制品的表面，例如晶片，以及 从而引起电气故障，导致制品的产量和可靠性降低等问题。 一种抗蚀剂去除方法，包括在其上存在抗蚀剂的制品上形成粘合剂层，并将粘合层作为包含抗蚀剂材料的联合薄片从制品上剥离，其特征在于粘合剂层被调节成具有 剥离时的弹性模量为1Kg / mm 2以上，以及用于该方法的粘合剂或粘合片。

公开(公告)号：US07309925B2

公开(公告)日：2007-12-18

申请号：US11012998

申请日：2004-12-15

申请人： Takeshi Matsumura ,  Masayuki Yamamoto

发明人： Takeshi Matsumura ,  Masayuki Yamamoto

IPC分类号： H01L23/544 ,  H01L21/768 ,  H01L21/78 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L21/46

CPC分类号： H01L21/6836 ,  H01L22/20 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00

摘要： A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

摘要翻译： 切割芯片接合膜具有支撑基板，形成在支撑基板上的粘合层，以及形成在粘合剂层上的芯片接合粘合剂层，并且还具有用于识别芯片粘合粘合剂层的位置的标记。 可以提供一种切割芯片接合膜，其中在半导体晶片和切割芯片接合膜彼此粘合的情况下，可以识别膜中的芯片粘合粘合剂层的位置。

公开(公告)号：US07429522B2

公开(公告)日：2008-09-30

申请号：US11947727

申请日：2007-11-29

申请人： Takeshi Matsumura ,  Masayuki Yamamoto

发明人： Takeshi Matsumura ,  Masayuki Yamamoto

IPC分类号： H01L21/78 ,  H01L21/46 ,  H01L21/301 ,  H01L21/76 ,  H01L23/544 ,  H01L21/768 ,  H01L21/44

CPC分类号： H01L21/6836 ,  H01L22/20 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00

摘要： A dicing die-bonding film has a supporting substrate, an adhesive layer formed on the supporting substrate, and a die-bonding adhesive layer formed on the adhesive layer, and further has a mark for recognizing the position of the die-bonding adhesive layer. It is possible to provide a dicing die-bonding film in which in the case a semiconductor wafer and the dicing die-bonding film are stuck onto each other, the position of the die-bonding adhesive layer in the film can be recognized.

摘要翻译： 切割芯片接合膜具有支撑基板，形成在支撑基板上的粘合层，以及形成在粘合剂层上的芯片接合粘合剂层，并且还具有用于识别芯片粘合粘合剂层的位置的标记。 可以提供一种切割芯片接合膜，其中在半导体晶片和切割芯片接合膜彼此粘合的情况下，可以识别膜中的芯片粘合粘合剂层的位置。

公开(公告)号：US09177425B2

公开(公告)日：2015-11-03

申请号：US14005838

申请日：2012-03-19

申请人： Hideaki Suganuma ,  Takeshi Matsumura ,  Toshiro Hikita

发明人： Hideaki Suganuma ,  Takeshi Matsumura ,  Toshiro Hikita

IPC分类号： G07C5/00 ,  G06F15/00 ,  G05B23/02

CPC分类号： G07C5/00 ,  G05B23/0221 ,  G06F15/00

摘要： A vehicle data analysis apparatus analyzes vehicle data that indicates chronological change of a vehicle state. The vehicle data analysis apparatus is provided with a computing unit and a recognition unit. The computing unit is configured to make obvious data fluctuation accompanying the development, in the vehicle data, of mechanical or control-related fault in a vehicle control system. The recognition unit is configured to recognize the vehicle data to be considered during vehicle fault diagnosis on the basis of a result of computation by the computing unit.

摘要翻译： 车辆数据分析装置分析指示车辆状态的时间变化的车辆数据。 车辆数据分析装置具有计算单元和识别单元。 计算单元被配置为伴随车辆控制系统中的机械或控制相关故障的车辆数据的开发中的明显的数据波动。 识别单元被配置为基于计算单元的计算结果来识别在车辆故障诊断期间要考虑的车辆数据。

公开(公告)号：US09154487B2

公开(公告)日：2015-10-06

申请号：US13883233

申请日：2010-11-05

申请人： Shingo Murakami ,  Johan Hjelm ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

发明人： Shingo Murakami ,  Johan Hjelm ,  Takeshi Matsumura ,  Toshikane Oda ,  Kenta Yasukawa

IPC分类号： H04L29/06

CPC分类号： H04L63/08 ,  H04L63/0281 ,  H04L63/062 ,  H04L63/0807 ,  H04W12/04

摘要： The present invention relates to auto-provisioning of authentication data for client devices. A registration server includes a gateway determination unit, which is configured to determine a gateway apparatus transferring a request signal from a device, and a processing unit. The processing unit is configured to transmit a first signal including a token and first access information of the gateway apparatus to the device if an identifier of the gateway apparatus is stored on the server, and to transmit a second signal indicating a positive response to the gateway apparatus when it obtains the token and the identifier based on a third signal received in response to the first signal. The gateway apparatus sends the secret value to the device when it receives the second signal.

摘要翻译： 本发明涉及自动提供客户端设备的认证数据。 注册服务器包括网关确定单元，其被配置为确定从设备传送请求信号的网关装置和处理单元。 处理单元被配置为如果网关装置的标识符存储在服务器上，则将包括令牌的第一信号和网关装置的第一访问信息发送到设备，并且向网关发送指示肯定响应的第二信号 当其基于响应于第一信号接收的第三信号获得令牌和标识符时的装置。 当接收到第二信号时，网关装置向设备发送秘密值。

公开(公告)号：US09153556B2

公开(公告)日：2015-10-06

申请号：US12759470

申请日：2010-04-13

申请人： Takeshi Matsumura ,  Sadahito Misumi ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

发明人： Takeshi Matsumura ,  Sadahito Misumi ,  Kazuhito Hosokawa ,  Hiroyuki Kondo

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/00 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/83 ,  H01L23/3121 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/98 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29371 ,  H01L2224/29386 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2224/85205 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/3011 ,  H01L2924/0635 ,  H01L2924/066 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.

摘要翻译： 用于制造半导体器件的粘合片是用于制造半导体器件的粘合片，当将半导体元件粘合到被粘物并且半导体元件被引线接合时使用，并且是可剥离的粘合片，其中180度剥离粘合强度 相对于硅晶片为5（N / 25mm宽）或更小。

公开(公告)号：US08845538B2

公开(公告)日：2014-09-30

申请号：US12989546

申请日：2009-04-14

申请人： Takeshi Matsumura

发明人： Takeshi Matsumura

IPC分类号： A61B8/00 ,  A61B5/00 ,  A61B8/08 ,  A61B8/13 ,  A61B8/06

CPC分类号： A61B8/485 ,  A61B5/6843 ,  A61B8/06 ,  A61B8/13 ,  A61B8/4281 ,  A61B8/488

摘要： The invention was made to simplify the operation relating to the detection of an absolute pressure applied to a test body by an ultrasonic probe and thereby to enhance usability. The fact that an elastic coupler has been attached to the ultrasonic wave transmitter/receiver surface and the fact that the elastic coupler is in an initial state with no pressure are detected (S2, S3), an initial thickness of the elastic coupler in the initial state is obtained (S6), the fact that the elastic coupler is in the pressurized state is detected based on the disappearance of a multiple echo which is included in an RF signal and caused due to the elastic coupler, the thickness of the elastic coupler in the pressurized state is obtained by detecting the boundary between the test body and the elastic coupler in the pressurized state, the thickness change is obtained based on the thickness in the pressurized state and the initial thickness (S7), and the absolute pressure applied to the test object is evaluated based on the thickness change and the pre-set elasticity property of the elastic coupler (S8).

摘要翻译： 本发明是为了简化与通过超声波探头对被检体施加的绝对压力的检测相关的操作，从而提高了可用性。 检测到弹性耦合器已经附着到超声波发射器/接收器表面以及弹性耦合器处于初始状态而没有压力的事实（S2，S3），初始的弹性耦合器的初始厚度 获得状态（S6），弹性耦合器处于加压状态的事实是基于包含在RF信号中并由弹性耦合器引起的多重回波的消失，弹性耦合器的厚度 通过在加压状态下检测试验体与弹性联轴器之间的边界来获得加压状态，基于加压状态下的厚度和初始厚度（S7）获得厚度变化，并且施加到 基于弹性联轴器的厚度变化和预设弹性特性来评价试验对象（S8）。

公开(公告)号：US08704382B2

公开(公告)日：2014-04-22

申请号：US12975893

申请日：2010-12-22

申请人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

发明人： Naohide Takamoto ,  Takeshi Matsumura ,  Goji Shiga

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/6836 ,  H01L21/561 ,  H01L23/3164 ,  H01L23/544 ,  H01L24/81 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/8101 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/831 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/3025 ,  Y10T428/28 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.

摘要翻译： 本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中 晶片粘合层的波长为532nm的光的透光率为40％以上，激光标记层的波长为532nm的光的透光率为40％以下。