发明授权
- 专利标题: Optical sub-assembly packaging techniques that incorporate optical lenses
- 专利标题(中): 包含光学透镜的光学子组件封装技术
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申请号: US11473820申请日: 2006-06-23
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公开(公告)号: US07431516B2公开(公告)日: 2008-10-07
- 发明人: William Paul Mazotti , Jia Liu , Luu Thanh Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
- 申请人: William Paul Mazotti , Jia Liu , Luu Thanh Nguyen , Haryanto Chandra , Peter Deane , Todd Thyes , Brian Huss , John Rukavina , Glenn Woodhouse
- 申请人地址: US CA Santa Clara
- 专利权人: National Semiconductor Corporation
- 当前专利权人: National Semiconductor Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Beyer Law Group LLP
- 主分类号: G02B6/36
- IPC分类号: G02B6/36
摘要:
Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.
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