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    Injection casting system for encapsulating semiconductor devices and method of use
    6.
    发明授权
    Injection casting system for encapsulating semiconductor devices and method of use 有权
    用于封装半导体器件的注塑系统及其使用方法

    公开(公告)号：US07153462B2

    公开(公告)日：2006-12-26

    申请号：US10831002

    申请日：2004-04-23

    申请人： Haryanto Chandra

    发明人： Haryanto Chandra

    IPC分类号： H01L21/56 ,  B29C45/14

    CPC分类号： H01L21/67126 ,  B29C39/10 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An injection casting system for encapsulating semiconductor products and method of use includes a mold unit having a cavity, a substrate material placed against the cavity, the cavity being filled by a liquid dispenser in contact with the bottom of the cavity and a running channel at the bottom of the cavity to receive the liquid dispenser for even dispersion of epoxy in the cavity from the bottom of the cavity upward to the top of the cavity.

    摘要翻译： 用于封装半导体产品的注射铸造系统和使用方法包括具有空腔的模具单元，抵靠空腔放置的基底材料，空腔由与腔的底部接触的液体分配器填充，并且在 空腔的底部以接收液体分配器，用于从空腔的底部向上到空腔的顶部在空腔中均匀分散环氧树脂。

    Laminating encapsulant film containing phosphor over LEDs
    7.
    发明授权
    Laminating encapsulant film containing phosphor over LEDs 有权
    在LED上含有磷光体的层压密封剂膜

    公开(公告)号：US08450147B2

    公开(公告)日：2013-05-28

    申请号：US13419520

    申请日：2012-03-14

    申请人： Haryanto Chandra

    发明人： Haryanto Chandra

    IPC分类号： H01L21/00

    CPC分类号： H01L33/505 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

    摘要： A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in each_bin are mounted on a single submount to form an array of LEDs. Various thin sheets of a flexible encapsulant (e.g., silicone) infused with one or more phosphors are preformed, where each sheet has different color conversion properties. An appropriate sheet is placed over an array of LED mounted on a submount, and the LEDs are energized. The resulting light is measured for CCT. If the CCT is acceptable, the phosphor sheet is permanently laminated onto the LEDs and submount. By selecting a different phosphor sheet for each bin of LEDs, the resulting CCT is very uniform across all bins.

    摘要翻译： 描述了使用磷光体的LED光的波长转换的过程。 针对相关色温（CCT）对LED芯片进行了测试，并根据其颜色发射进行分组。 each_bin中的LED安装在单个子安装板上以形成LED阵列。 注入了一种或多种磷光体的柔性密封剂（例如硅氧烷）的各种薄片被预成型，其中每片具有不同的颜色转换性质。 在安装在底座上的LED阵列上放置适当的片材，并且LED通电。 对CCT测量所得光。 如果CCT是可接受的，荧光粉片永久地层压到LED和底座上。 通过为LED的每个箱子选择不同的荧光粉片，所得到的CCT在所有的箱体上是非常均匀的。

    Laminating encapsulant film containing phosphor over LEDs
    8.
    发明授权
    Laminating encapsulant film containing phosphor over LEDs 有权
    在LED上含有磷光体的层压密封剂膜

    公开(公告)号：US07344952B2

    公开(公告)日：2008-03-18

    申请号：US11261122

    申请日：2005-10-28

    申请人： Haryanto Chandra

    发明人： Haryanto Chandra

    IPC分类号： H01L21/8222

    CPC分类号： H01L33/505 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

    摘要： A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in a single bin are mounted on a single submount to form an array of LEDs. Various thin sheets of a flexible encapsulant (e.g., silicone) infused with one or more phosphors are preformed, where each sheet has different color conversion properties. An appropriate sheet is placed over an array of LED mounted on a submount, and the LEDs are energized. The resulting light is measured for CCT. If the CCT is acceptable, the phosphor sheet is permanently laminated onto the LEDs and submount. The lamination encapsulates each LED to protect the LEDs from contaminants and damage. The LEDs in the array of LEDs on the submount are separated. By selecting a different phosphor sheet for each bin of LEDs, the resulting CCT is very uniform across all bins.

    摘要翻译： 描述了使用磷光体的LED光的波长转换的过程。 针对相关色温（CCT）对LED芯片进行了测试，并根据其颜色发射进行分组。 单个箱中的LED安装在单个底座上以形成LED阵列。 注入了一种或多种磷光体的柔性密封剂（例如硅氧烷）的各种薄片被预成型，其中每片具有不同的颜色转换性质。 在安装在底座上的LED阵列上放置适当的片材，并且LED通电。 对CCT测量所得光。 如果CCT是可接受的，荧光粉片永久地层压到LED和底座上。 层压封装每个LED以保护LED免受污染物和损坏。 子安装板上的LED阵列中的LED分开。 通过为LED的每个箱子选择不同的荧光粉片，所得到的CCT在所有的箱体上是非常均匀的。

    Laminating encapsulant film containing phosphor over LEDS
    9.
    发明申请
    Laminating encapsulant film containing phosphor over LEDS 有权
    在LEDS上含有磷光体的层压密封膜

    公开(公告)号：US20070096131A1

    公开(公告)日：2007-05-03

    申请号：US11261122

    申请日：2005-10-28

    申请人： Haryanto Chandra

    发明人： Haryanto Chandra

    IPC分类号： H01L33/00

    CPC分类号： H01L33/505 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

    摘要： A process is described for wavelength conversion of LED light using phosphors. LED dies are tested for correlated color temperature (CCT), and binned according to their color emission. The LEDs in a single bin are mounted on a single submount to form an array of LEDs. Various thin sheets of a flexible encapsulant (e.g., silicone) infused with one or more phosphors are preformed, where each sheet has different color conversion properties. An appropriate sheet is placed over an array of LED mounted on a submount, and the LEDs are energized. The resulting light is measured for CCT. If the CCT is acceptable, the phosphor sheet is permanently laminated onto the LEDs and submount. The lamination encapsulates each LED to protect the LEDs from contaminants and damage. The LEDs in the array of LEDs on the submount are separated. By selecting a different phosphor sheet for each bin of LEDs, the resulting CCT is very uniform across all bins.

    摘要翻译： 描述了使用磷光体的LED光的波长转换的过程。 针对相关色温（CCT）对LED芯片进行了测试，并根据其颜色发射进行分组。 单个箱中的LED安装在单个底座上以形成LED阵列。 注入了一种或多种磷光体的柔性密封剂（例如硅氧烷）的各种薄片被预成型，其中每片具有不同的颜色转换性质。 在安装在底座上的LED阵列上放置适当的片材，并且LED通电。 对CCT测量所得光。 如果CCT是可接受的，荧光粉片永久地层压到LED和底座上。 层压封装每个LED以保护LED免受污染物和损坏。 子安装板上的LED阵列中的LED分开。 通过为LED的每个箱子选择不同的荧光粉片，所得到的CCT在所有的箱体上是非常均匀的。

    Injection casting system for encapsulating semiconductor devices and method of use
    10.
    发明申请
    Injection casting system for encapsulating semiconductor devices and method of use 有权
    用于封装半导体器件的注塑系统及其使用方法

    公开(公告)号：US20050238747A1

    公开(公告)日：2005-10-27

    申请号：US10831002

    申请日：2004-04-23

    申请人： Haryanto Chandra

    发明人： Haryanto Chandra

    IPC分类号： B29C45/27 ,  B29C39/10 ,  B29C39/24 ,  B29C45/14 ,  B29L31/34 ,  H01L21/00 ,  H01L21/56 ,  H01L23/495

    CPC分类号： H01L21/67126 ,  B29C39/10 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An injection casting system for encapsulating semiconductor products and method of use includes a mold unit having a cavity, a substrate material placed against the cavity, the cavity being filled by a liquid dispenser in contact with the bottom of the cavity and a running channel at the bottom of the cavity to receive the liquid dispenser for even dispersion of epoxy in the cavity from the bottom of the cavity upward to the top of the cavity.

    摘要翻译： 用于封装半导体产品的注射铸造系统和使用方法包括具有空腔的模具单元，抵靠空腔放置的基底材料，空腔由与腔的底部接触的液体分配器填充，并且在 空腔的底部以接收液体分配器，用于从空腔的底部向上到空腔的顶部在空腔中均匀分散环氧树脂。