发明授权
- 专利标题： Semiconductor device with a substrate having a spiral shaped coil
- 专利标题（中）： 具有基板的半导体器件具有螺旋形线圈
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申请号： US11314039申请日： 2005-12-20
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公开(公告)号： US07432580B2公开(公告)日： 2008-10-07
- 发明人: Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Kazunari Kurokawa , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta , Tetsuro Sawai , Toshikazu Imaoka
- 申请人： Akihiro Sato , Satoru Sekiguchi , Kiyokazu Kamado , Kazunari Kurokawa , Makoto Tsubonoya , Kiyoshi Mita , Yoichi Nabeta , Tetsuro Sawai , Toshikazu Imaoka
- 申请人地址： JP Osaka JP Gunma
- 专利权人： Sanyo Electric Co., Ltd.,Kanto Sanyo Semiconductors Co., Ltd.
- 当前专利权人： Sanyo Electric Co., Ltd.,Kanto Sanyo Semiconductors Co., Ltd.
- 当前专利权人地址： JP Osaka JP Gunma
- 代理机构： SoCal IP Law Group LLP
- 代理商 Steven C. Sereboff; John E. Gunther
- 优先权： JP2004-370031 20041221; JP2005-329184 20051114
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H05K7/00
摘要：
A semiconductor apparatus comprises a substrate, a semiconductor chip fixedly secured on one side of the substrate, a spirally shaped coil formed on the other side of the substrate and electrically connected to the semiconductor chip, and a conductive pattern formed on a surface of the one side of the substrate facing to the semiconductor chip for stabilizing an inductance characteristic of the coil.
公开/授权文献
- US20060131724A1 Semiconductor apparatus and circuit apparatus 公开/授权日：2006-06-22
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