发明授权
- 专利标题： Method of forming solder resist pattern
- 专利标题（中）： 形成阻焊图案的方法
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申请号： US10677182申请日： 2003-10-02
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公开(公告)号： US07435352B2公开(公告)日： 2008-10-14
- 发明人: Jee-Soo Mok , Jang-Kyu Kang , Chang-Hyun Nam
- 申请人： Jee-Soo Mok , Jang-Kyu Kang , Chang-Hyun Nam
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Christensen O'Connor Johnson Kindness PLLC
- 优先权： KR10-2003-0035652 20030603
- 主分类号： H01B13/00
- IPC分类号： H01B13/00
摘要：
A method for forming a solder resist pattern includes laminating a semi-cured thermosetting film on both sides of a substrate and laser ablating the laminated thermosetting film according to a solder resist mask pattern. The method is applicable to multilayer printed circuit boards, which are fabricated either by the buildup process or the parallel process. Lower manufacturing costs and improved accuracy of the solder resist pattern can be achieved due to the simplified process.
公开/授权文献
- US20040248410A1 Method of forming solder resist pattern 公开/授权日：2004-12-09
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