发明授权
US07435447B2 Method and system for determining flow conditions in a high pressure processing system
失效
用于确定高压处理系统中的流动状况的方法和系统
- 专利标题： Method and system for determining flow conditions in a high pressure processing system
- 专利标题（中）： 用于确定高压处理系统中的流动状况的方法和系统
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申请号： US11058327申请日： 2005-02-15
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公开(公告)号： US07435447B2公开(公告)日： 2008-10-14
- 发明人: Wayne M. Parent
- 申请人： Wayne M. Parent
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Wood, Herron & Evans, L.L.P.
- 主分类号： B05D3/12
- IPC分类号： B05D3/12
摘要：
In a high pressure processing system configured to treat a substrate, a flow measurement device is utilized to determine a flow condition in the high pressure processing system. The flow measurement device can, for example, comprise a turbidity meter. The flow parameter can, for example, include a volume flow rate or a time to achieve mixing of a process chemistry within a high pressure fluid used to treat the substrate.
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