A semiconductor process and apparatus includes forming a semiconductor device by depositing a layer of nitride (20) over a semiconductor structure (10), patterning and etching the nitride layer to form a patterned nitride layer (42, 44), depositing a layer of polysilicon (62), planarizing the polysilicon layer with a CMP process to remove any portion of the polysilicon layer (62) above the patterned dielectric layer (42, 44), and then removing the patterned nitride layer (42, 44), thereby defining one or more polysilicon features (72, 74, 76) that can be used as floating gates, transistors gates, bit lines or any other semiconductor device feature.