- 专利标题： Wafer-level bonding for mechanically reinforced ultra-thin die
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申请号： US11479835申请日： 2006-06-30
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公开(公告)号： US07435664B2公开(公告)日： 2008-10-14
- 发明人: Daoqiang Lu , John Tang
- 申请人： Daoqiang Lu , John Tang
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.