The invention provides a new floor covering panel and floor covering system in which the floor covering panels include first and second generally planar surfaces, first and second side edges containing first and second complementary coupling members, respectively, and an adhesive composition selectively applied to at least a portion of at least one of the first and second coupling members. The adhesive composition providing the adhesive bond may be applied to at least one of the first or second coupling members during the floor covering manufacturing process. After a floor covering system is assembled, the adhesive composition provides a substantially non-refastenable bond between mated floor covering panels.