公开(公告)号：US07796388B2

公开(公告)日：2010-09-14

申请号：US12400081

申请日：2009-03-09

Applicant: Randy H. Wiles ,  Andrew A. Wereszczak ,  Curtis W. Ayers ,  Kirk T. Lowe

Inventor： Randy H. Wiles ,  Andrew A. Wereszczak ,  Curtis W. Ayers ,  Kirk T. Lowe

IPC: H05K7/20 ,  F28D15/00

CPC classification number: H05K7/20927 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/32 ,  H01L25/07 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/00

Abstract: The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Abstract translation: 本公开描述直接冷却电力电子设备中的三维直接金属化（DM）层。 为了实现足够的冷却，在陶瓷衬底内形成冷却剂流动通道。 直接金属化层（通常为铜）可以结合到陶瓷衬底，并且可以将半导体芯片（例如IGBT和二极管）焊接或烧结到直接金属化层上以形成电力电子模块。 多个模块可以附接到冷却集管，冷却集管通过陶瓷衬底中的通道提供冷却剂的流入和流出。 模块和冷却集管组件优选地被设计成装配在环形电容器的芯部内部。

公开(公告)号：US20090231812A1

公开(公告)日：2009-09-17

申请号：US12400081

申请日：2009-03-09

Applicant: Randy H. Wiles ,  Andrew A. Wereszczak ,  Curtis W. Ayers ,  Kirk T. Lowe

Inventor： Randy H. Wiles ,  Andrew A. Wereszczak ,  Curtis W. Ayers ,  Kirk T. Lowe

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/32 ,  H01L25/07 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/00

Abstract: The disclosure describes directly cooling a three-dimensional, direct metallization (DM) layer in a power electronics device. To enable sufficient cooling, coolant flow channels are formed within the ceramic substrate. The direct metallization layer (typically copper) may be bonded to the ceramic substrate, and semiconductor chips (such as IGBT and diodes) may be soldered or sintered onto the direct metallization layer to form a power electronics module. Multiple modules may be attached to cooling headers that provide in-flow and out-flow of coolant through the channels in the ceramic substrate. The modules and cooling header assembly are preferably sized to fit inside the core of a toroidal shaped capacitor.

Abstract translation: 本公开描述直接冷却电力电子设备中的三维直接金属化（DM）层。 为了实现足够的冷却，在陶瓷衬底内形成冷却剂流动通道。 直接金属化层（通常为铜）可以结合到陶瓷衬底，并且可以将半导体芯片（例如IGBT和二极管）焊接或烧结到直接金属化层上以形成电力电子模块。 多个模块可以附接到冷却集管，冷却集管通过陶瓷衬底中的通道提供冷却剂的流入和流出。 模块和冷却集管组件优选地被设计成装配在环形电容器的芯部内部。

公开(公告)号：US07441384B2

公开(公告)日：2008-10-28

申请号：US10219938

申请日：2002-08-14

Applicant: Robert J. Miller ,  Gregory Fowler ,  Benny Ray Wood ,  Kirk T. Lowe

Inventor： Robert J. Miller ,  Gregory Fowler ,  Benny Ray Wood ,  Kirk T. Lowe

IPC: E04B5/02

CPC classification number: E04F15/04 ,  E04F2201/0115 ,  E04F2201/026 ,  E04F2201/07

Abstract: The invention provides a new floor covering panel and floor covering system in which the floor covering panels include first and second generally planar surfaces, first and second side edges containing first and second complementary coupling members, respectively, and an adhesive composition selectively applied to at least a portion of at least one of the first and second coupling members. The adhesive composition providing the adhesive bond may be applied to at least one of the first or second coupling members during the floor covering manufacturing process. After a floor covering system is assembled, the adhesive composition provides a substantially non-refastenable bond between mated floor covering panels.

Abstract translation: 本发明提供了一种新的地板覆盖板和地板覆盖系统，其中地板覆盖板包括第一和第二大体上平坦的表面，第一和第二侧边缘分别包含第一和第二互补联接构件，并且粘合剂组合物至少选择性地施加到 所述第一和第二联接构件中的至少一个的一部分。 提供粘合剂粘合的粘合剂组合物可以在地板覆盖制造过程中施加到第一或第二联接构件中的至少一个。 在组装地板覆盖系统之后，粘合剂组合物在配合的地板覆盖板之间提供基本不可重新扣紧的粘结。