发明授权
- 专利标题： Electronic card assembly
- 专利标题（中）： 电子卡组装
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申请号： US11086324申请日： 2005-03-23
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公开(公告)号： US07441709B2公开(公告)日： 2008-10-28
- 发明人: Benson Chan , How T. Lin , Voya R. Markovich , Ronald V. Smith
- 申请人： Benson Chan , How T. Lin , Voya R. Markovich , Ronald V. Smith
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： G06K19/06
- IPC分类号： G06K19/06
摘要：
An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
公开/授权文献
- US20060213973A1 Electronic card assembly 公开/授权日：2006-09-28
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