公开(公告)号：US07441709B2

公开(公告)日：2008-10-28

申请号：US11086324

申请日：2005-03-23

申请人： Benson Chan ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

发明人： Benson Chan ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

IPC分类号： G06K19/06

CPC分类号： G06K19/005 ,  G06K7/084 ,  G06K17/00 ,  G06K19/07354 ,  G06K2017/0064

摘要： An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.

摘要翻译： 提供一种电子卡组件，其包括其中具有可移动卡的保护壳体。 在一个示例中具有磁条的卡在卡插入时被插入到壳体中被擦除并且在卡退出期间被重新写回到其信息部分（磁条）上，提供适当的人类信息（例如，从指纹） 被大会的阅读器组件接收。

公开(公告)号：US20120015532A1

公开(公告)日：2012-01-19

申请号：US12837640

申请日：2010-07-16

申请人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

发明人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

IPC分类号： H01R12/00 ,  H01L21/66

CPC分类号： H05K3/3436 ,  H05K1/111 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4919

摘要： A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

摘要翻译： 柔性，高密度贴花及其在柔性芯片载体和印刷线路板之间形成可拆卸电互连的方法。 柔性贴花在第一表面上具有细间距焊盘，并且在第二表面上具有比微细间距更宽的间距的焊盘，设计成电连接到半导体器件的第一表面上的细间距焊盘和较宽间距 第二表面上的焊盘被设计成电连接到印刷线路板等。 第一表面上的焊盘通过柔性贴花中的一个或多个绝缘水平导电地连接到第二表面上的焊盘。

公开(公告)号：US07629559B2

公开(公告)日：2009-12-08

申请号：US11305073

申请日：2005-12-19

申请人： Subahu D. Desai ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

发明人： Subahu D. Desai ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich ,  Ronald V. Smith

IPC分类号： H05B1/02

CPC分类号： H05K3/4069 ,  H05K1/0293 ,  H05K3/105 ,  H05K2201/096 ,  H05K2203/105

摘要： A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.

摘要翻译： 一种改进电路化基板中的导电糊料连接的方法，其中施加至少一个并且优选一系列高压脉冲施加在该糊料上并且至少一个并且优选地一系列高电流脉冲，两个脉冲串分别施加 。 结果是通过粘合连接的导电路径的数量从在脉冲应用之前存在的导电路径的数量增加以及所述连接中相应的电阻减小。

公开(公告)号：US08240031B2

公开(公告)日：2012-08-14

申请号：US12837640

申请日：2010-07-16

申请人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

发明人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

IPC分类号： H05K3/30

CPC分类号： H05K3/3436 ,  H05K1/111 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4919

摘要： A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

摘要翻译： 柔性，高密度贴花及其在柔性芯片载体和印刷线路板之间形成可拆卸电互连的方法。 柔性贴花在第一表面上具有细间距焊盘，并且在第二表面上具有比微细间距更宽的间距的焊盘，设计成电连接到半导体器件的第一表面上的细间距焊盘和较宽间距 第二表面上的焊盘被设计成电连接到印刷线路板等。 第一表面上的焊盘通过柔性贴花中的一个或多个绝缘水平导电地连接到第二表面上的焊盘。

公开(公告)号：US06712261B2

公开(公告)日：2004-03-30

申请号：US10102129

申请日：2002-03-20

申请人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

发明人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC分类号： B23K3102

CPC分类号： H01L21/486 ,  B23K1/20 ,  H05K3/4046 ,  H05K2201/10234 ,  H05K2201/10287

摘要： An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.

摘要翻译： 一种用于将金属元件的长度的前端插入到形成在基板中的通孔中并且用于在将金属元件的插入的前导部分从其中切断之前将插入的前导部分变形为预定构造的布置和方法 金属元件的长度。

公开(公告)号：US06982387B2

公开(公告)日：2006-01-03

申请号：US09884778

申请日：2001-06-19

申请人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

发明人： Richard R. Hall ,  How T. Lin ,  Christopher J. Majka ,  Matthew F. Seward ,  Ronald V. Smith

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H05K3/4046 ,  H05K3/4614 ,  H05K2201/0382 ,  H05K2201/096 ,  H05K2201/10234 ,  H05K2201/10416

摘要： A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.

摘要翻译： 一种用于在层压板内形成导电路径的方法和相关结构。 导电元件被压入层压板中的开口中，使得导电元件的至少一端的一部分延伸超过层压体的表面。 对导电元件的至少一个端部的部分施加压缩压力。 施加到导电元件的至少一个端部的压缩压力形成延伸超过层压体表面的接触垫。 导电元件可以包括被外部元件覆盖的内部元件。

公开(公告)号：US4347997A

公开(公告)日：1982-09-07

申请号：US133095

申请日：1980-03-24

申请人： Geoffrey M. Byham ,  Ronald V. Smith

发明人： Geoffrey M. Byham ,  Ronald V. Smith

IPC分类号： B64C27/82

CPC分类号： B64C27/82 ,  B64C2027/8218 ,  B64C2027/8227 ,  B64C2027/829

摘要： A helicopter including a power absorber arranged to selectively absorb power from a sustaining rotor system during deceleration. In an illustrated embodiment for a helicopter having a single sustaining rotor, the power absorber comprises a tail rotor assembly having two tail rotors located one on each side of a tail cone, and a control operative to adjust the pitch setting of the tail rotors to provide lateral thrust forces in opposed directions with a net lateral thrust force in one direction in order to maintain a desired heading during deceleration.

摘要翻译： 一种包括功率吸收器的直升机，其布置成在减速期间选择性地从维持转子系统吸收动力。 在具有单个维持转子的直升机的示出的实施例中，功率吸收器包括具有位于尾锥每侧的两个尾部转子的尾部转子组件，以及用于调节尾部转子的俯仰设置以提供 横向推力在相反的方向上具有在一个方向上的净侧推力，以便在减速期间保持期望的航向。