Invention Grant
- Patent Title: Electronic card assembly
- Patent Title (中): 电子卡组装
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Application No.: US11086324Application Date: 2005-03-23
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Publication No.: US07441709B2Publication Date: 2008-10-28
- Inventor: Benson Chan , How T. Lin , Voya R. Markovich , Ronald V. Smith
- Applicant: Benson Chan , How T. Lin , Voya R. Markovich , Ronald V. Smith
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
An electronic card assembly is provided which includes a protective housing having a movable card therein. The card, in one example one having a magnetic stripe, has its information erased when being inserted into the housing and re-written back onto its information portion (magnetic stripe) during card withdrawal, provided appropriate human information (e.g., from a fingerprint) is received by the assembly's reader component.
Public/Granted literature
- US20060213973A1 Electronic card assembly Public/Granted day:2006-09-28
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