Invention Grant
- Patent Title: Light source module
- Patent Title (中): 光源模块
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Application No.: US11302164Application Date: 2005-12-14
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Publication No.: US07441925B2Publication Date: 2008-10-28
- Inventor: Shen-Hong Chou , Pang-Hsuan Liu
- Applicant: Shen-Hong Chou , Pang-Hsuan Liu
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corporation
- Current Assignee: AU Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW94118349A 20050603
- Main IPC: F21V29/00
- IPC: F21V29/00

Abstract:
A method for assembling light emitting diode units and a substrate in a light source module and a structure thereof are provided. The light emitting diode unit is made of a light emitting diode and a carrier. Every light emitting diode has a flanged profile in the bottom to form a leaned plane, and a corresponding hole is formed on the substrate. Hence, when the light emitting diodes are pressed on the surface of a radiator by the substrate to make a closer contact, the light emitting diodes will be able to bear the pressure by the flanged design.
Public/Granted literature
- US20060274528A1 Light source module Public/Granted day:2006-12-07
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