Invention Grant
- Patent Title: Transparent conductive layer forming method, transparent conductive layer formed by the method, and material comprising the layer
- Patent Title (中): 透明导电层形成方法，通过该方法形成的透明导电层和包含该层的材料
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Application No.: US11536910Application Date: 2006-09-29
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Publication No.: US07442627B2Publication Date: 2008-10-28
- Inventor: Toshio Tsuji , Hiroto Itoh , Takakazu Kiyomura
- Applicant: Toshio Tsuji , Hiroto Itoh , Takakazu Kiyomura
- Applicant Address: JP Tokyo
- Assignee: Konica Corporation
- Current Assignee: Konica Corporation
- Current Assignee Address: JP Tokyo
- Agency: Lucas & Mercanti, LLP
- Priority: JP2001-368412 20011203
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/08 ; H01L21/20 ; H01L21/36
Abstract:
A transparent conductive layer forming method is disclosed which comprises the steps of introducing a reactive gas to a discharge space, exciting the reactive gas in a plasma state by discharge at atmospheric pressure or at approximately atmospheric pressure, and exposing a substrate to the reactive gas in a plasma state to form a transparent conductive layer on the substrate, wherein the reactive gas comprises a reducing gas.
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