Invention Grant
- Patent Title: Integrated ball and via package and formation process
- Patent Title (中): 集成球和通道包装和形成过程
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Application No.: US11123858Application Date: 2005-05-05
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Publication No.: US07442641B2Publication Date: 2008-10-28
- Inventor: David T. Beatson , Jamin Ling
- Applicant: David T. Beatson , Jamin Ling
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/52 ; H01L23/48 ; H01L23/40 ; H01L23/538
Abstract:
A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
Public/Granted literature
- US20050260791A1 Integrated ball and via package and formation process Public/Granted day:2005-11-24
Information query
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