发明授权
- 专利标题： Integrated ball and via package and formation process
- 专利标题（中）： 集成球和通道包装和形成过程
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申请号： US11123858申请日： 2005-05-05
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公开(公告)号： US07442641B2公开(公告)日： 2008-10-28
- 发明人: David T. Beatson , Jamin Ling
- 申请人： David T. Beatson , Jamin Ling
- 申请人地址： US PA Fort Washington
- 专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人： Kulicke and Soffa Industries, Inc.
- 当前专利权人地址： US PA Fort Washington
- 代理商 Christopher M. Spletzer
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/52 ; H01L23/48 ; H01L23/40 ; H01L23/538
摘要：
A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
公开/授权文献
- US20050260791A1 Integrated ball and via package and formation process 公开/授权日：2005-11-24
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