发明授权
US07446405B2 Wafer level chip scale package (WLCSP) with high reliability against thermal stress
有权
晶圆级芯片级封装（WLCSP）具有高可靠性抗热应力
- 专利标题： Wafer level chip scale package (WLCSP) with high reliability against thermal stress
- 专利标题（中）： 晶圆级芯片级封装（WLCSP）具有高可靠性抗热应力
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申请号： US11648281申请日： 2006-12-29
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公开(公告)号： US07446405B2公开(公告)日： 2008-11-04
- 发明人: Jong Hoon Kim , Min Suk Suh , Chang Jun Park , Kwon Whan Han , Seong Cheol Kim
- 申请人： Jong Hoon Kim , Min Suk Suh , Chang Jun Park , Kwon Whan Han , Seong Cheol Kim
- 申请人地址： KR Kyoungki-do
- 专利权人： Hynix Semiconductor Inc.
- 当前专利权人： Hynix Semiconductor Inc.
- 当前专利权人地址： KR Kyoungki-do
- 代理机构： Ladas & Parry LLP
- 优先权： KR10-2006-0012181 20060208
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A wafer level chip scale package includes a semiconductor chip having a plurality of pads; a lower insulation layer having a high Young's modulus of 1˜5 GPa formed on the semiconductor chip to expose the plurality of pads; a plurality of metal patterns formed on the lower insulation layer to be connected to the respective pads; an upper insulation layer having a high Young's modulus of 1˜5 GPa formed on the lower insulation layer and the metal patterns to partially expose the metal patterns; and a plurality of solder balls formed on exposed portions of the metal patterns.