Invention Grant
- Patent Title: Peel-off plate for an electronic-part delivery system
- Patent Title (中): 剥离板用于电子部件输送系统
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Application No.: US10874581Application Date: 2004-06-24
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Publication No.: US07448129B2Publication Date: 2008-11-11
- Inventor: Cheng-Wei Chiu , Kuo-Chou Cheng , Chin-Chan Chen , En-Hsien Lee , Wei-Sheng Hung
- Applicant: Cheng-Wei Chiu , Kuo-Chou Cheng , Chin-Chan Chen , En-Hsien Lee , Wei-Sheng Hung
- Applicant Address: TW Taipei
- Assignee: Asustek Computer, Inc.
- Current Assignee: Asustek Computer, Inc.
- Current Assignee Address: TW Taipei
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW92211824U 20030627
- Main IPC: B23P19/00
- IPC: B23P19/00
Abstract:
A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.
Public/Granted literature
- US20050014293A1 Peel-off plate for an electronic-part delivery system Public/Granted day:2005-01-20
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