公开(公告)号：US07448129B2

公开(公告)日：2008-11-11

申请号：US10874581

申请日：2004-06-24

Applicant: Cheng-Wei Chiu ,  Kuo-Chou Cheng ,  Chin-Chan Chen ,  En-Hsien Lee ,  Wei-Sheng Hung

Inventor： Cheng-Wei Chiu ,  Kuo-Chou Cheng ,  Chin-Chan Chen ,  En-Hsien Lee ,  Wei-Sheng Hung

IPC: B23P19/00

CPC classification number: H05K13/0417 ,  H05K13/0084 ,  Y10T29/49121 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

Abstract: A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.

Abstract translation: 用于电子部件传送系统的剥离装置具有前端部和从前端部向内凹入的凹部，该前端部通过前端部的上表面和下表面形成并且具有大于 电子部件的预定规格。

公开(公告)号：US20050014293A1

公开(公告)日：2005-01-20

申请号：US10874581

申请日：2004-06-24

Applicant: Cheng-Wei Chiu ,  Kuo-Chou Cheng ,  Chin-Chan Chen ,  En-Hsien Lee ,  Wei-Sheng Hung

Inventor： Cheng-Wei Chiu ,  Kuo-Chou Cheng ,  Chin-Chan Chen ,  En-Hsien Lee ,  Wei-Sheng Hung

IPC: H01L21/00 ,  H05K7/12 ,  H05K13/00 ,  H05K13/04

CPC classification number: H05K13/0417 ,  H05K13/0084 ,  Y10T29/49121 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

Abstract: A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.

Abstract translation: 用于电子部件传送系统的剥离装置具有前端部和从前端部向内凹入的凹部，该前端部通过前端部的上表面和下表面形成并且具有大于 电子部件的预定规格。