Invention Grant
- Patent Title: Heat treatment apparatus
- Patent Title (中): 热处理设备
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Application No.: US11058279Application Date: 2005-02-16
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Publication No.: US07448604B2Publication Date: 2008-11-11
- Inventor: Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
- Applicant: Tae-gyu Kim , Dong-woo Lee , Jin-sung Lee , Tae-sang Park , Bang-weon Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2004-0045856 20040619
- Main IPC: B01F3/04
- IPC: B01F3/04

Abstract:
Provided is a heat treatment apparatus. The heat treatment apparatus includes a heating plate including a heater; a chamber case including a cooling chamber, and coupled to a lower portion of the heating plate; and at least one atomizing unit installed on the chamber case to generate liquid droplet aerosol by mixing a cooling liquid and a gas, and at the same time, to inject the liquid droplet aerosol into the cooling chamber.
Public/Granted literature
- US20050280681A1 Heat treatment apparatus Public/Granted day:2005-12-22
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