Invention Grant
- Patent Title: Method and apparatus for filling vias
- Patent Title (中): 填充通孔的方法和装置
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Application No.: US10700327Application Date: 2003-11-03
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Publication No.: US07449067B2Publication Date: 2008-11-11
- Inventor: Paul S. Andry , Jon A. Casey , Raymond R. Horton , Chiraq S. Patel , Edmund J. Sprogis , Brian R. Sundlof
- Applicant: Paul S. Andry , Jon A. Casey , Raymond R. Horton , Chiraq S. Patel , Edmund J. Sprogis , Brian R. Sundlof
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Robert M. Trepp; David Aker
- Main IPC: B05C1/00
- IPC: B05C1/00 ; B05C3/00 ; B05C3/18
Abstract:
A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.
Public/Granted literature
- US20050106834A1 Method and apparatus for filling vias Public/Granted day:2005-05-19
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