公开(公告)号：US07294909B2

公开(公告)日：2007-11-13

申请号：US11099161

申请日：2005-04-05

申请人： Jon A. Casey ,  James G. Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David C. Long ,  Lori A. Maiorino ,  Arthur G. Merryman ,  Glenn A. Pomerantz ,  Robert A. Rita ,  Krystyna W. Semkow ,  Patrick E. Spencer ,  Brian R. Sundlof ,  Richard P. Surprenant ,  Donald R. Wall ,  Thomas A. Wassick ,  Kathleen M. Wiley

发明人： Jon A. Casey ,  James G. Balz ,  Michael Berger ,  Jerome Cohen ,  Charles Hendricks ,  Richard Indyk ,  Mark LaPlante ,  David C. Long ,  Lori A. Maiorino ,  Arthur G. Merryman ,  Glenn A. Pomerantz ,  Robert A. Rita ,  Krystyna W. Semkow ,  Patrick E. Spencer ,  Brian R. Sundlof ,  Richard P. Surprenant ,  Donald R. Wall ,  Thomas A. Wassick ,  Kathleen M. Wiley

IPC分类号： H01L27/148 ,  H01L29/768

CPC分类号： H05K3/225 ,  H01L21/4846 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4629 ,  H05K2203/173 ,  Y10T29/49124 ,  Y10T29/49135 ,  H01L2924/00

摘要： A multilayer ceramic repair process which provides a new electrical repair path to connect top surface vias. The repair path is established between a defective net and a redundant repair net contained within the multilayer ceramic substrate. The defective net and the repair net each terminate at surface vias of the substrate. A laser is used to form post fired circuitry on and in the substrate. This is followed by the electrical isolation of the defective net from the electrical repair structure and passivation of the electrical repair line.

摘要翻译： 一种多层陶瓷修复工艺，提供了一个新的电气修复路径，以连接顶面通孔。 修复路径是建立在有缺陷的网和包含在多层陶瓷基板内的冗余修复网之间。 有缺陷的网和修复网各自终止在基板的表面通孔处。 使用激光器在基板上和基板上形成点火电路。 之后是有缺陷的网络与电气修复结构的电气隔离和电气修复线路的钝化。

公开(公告)号：US07199450B2

公开(公告)日：2007-04-03

申请号：US10908480

申请日：2005-05-13

申请人： Jon A. Casey ,  Michael Berger ,  Leena P. Buchwalter ,  Donald F. Canaperi ,  Raymond R. Horton ,  Anurag Jain ,  Eric D. Perfecto ,  James A. Tornello

发明人： Jon A. Casey ,  Michael Berger ,  Leena P. Buchwalter ,  Donald F. Canaperi ,  Raymond R. Horton ,  Anurag Jain ,  Eric D. Perfecto ,  James A. Tornello

IPC分类号： H01L29/06 ,  H01L23/58

CPC分类号： H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.

摘要翻译： 使用无粘性，低粘度，高温稳定的聚合物或低粘度的高固含量聚合物溶液密封通孔，其中聚合物材料在高温下浸渍在通孔内。 引入供应室以在升高的温度下施用聚合物材料，通常在高至足以液化聚合物材料的温度下。 聚合物材料通过来自泵，活塞或保持在所述供应室内的真空的力的加热供应管线引入。

公开(公告)号：US06278049B1

公开(公告)日：2001-08-21

申请号：US09543689

申请日：2000-04-05

申请人： Gregory M. Johnson ,  Jon A. Casey ,  Scott R. Dwyer ,  David C. Long ,  Kevin M. Prettyman

发明人： Gregory M. Johnson ,  Jon A. Casey ,  Scott R. Dwyer ,  David C. Long ,  Kevin M. Prettyman

IPC分类号： H01L3534

CPC分类号： H01L23/38 ,  H01L35/32 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2224/0401

摘要： Thermoelectric devices having enhanced thermal characteristics are fabricated using multilayer ceramic (MLC) technology methods. Aluminum nitride faceplates with embedded electrical connections provide the electrical series configuration for alternating dissimilar semiconducting materials. Embedded electrical connections are formed by vias and lines in the faceplate. A portion of the dissimilar materials are then melted within the tunnels to form a bond. Thermal conductivity of the faceplate is enhanced by adding electrically isolated vias to one surface, filled with high thermal conductivity metal paste. A low thermal conductivity material is also introduced between the two high thermal conductivity material faceplates. Alternating semiconducting materials are introduced within the varying thermal conductivity layers by punching vias within greensheets of predetermined thermal conductivity and filling with n-type and p-type paste or may also be patterned in linear or radial fanout patterns through screening techniques and lamination of wire structures. a liquid channel within the faceplate is used to enhance thermal energy transfer. Thermoelectric devices are physically incorporated within the IC package using MLC technology.

摘要翻译： 具有增强的热特性的热电装置使用多层陶瓷（MLC）技术方法制造。 具有嵌入式电连接的氮化铝面板为交替的不同的半导体材料提供了电气串联配置。 嵌入式电气连接由面板中的通孔和线形成。 然后将不同材料的一部分在隧道内熔化以形成粘结。 通过向一个表面添加电隔离的通孔，填充高导热性金属膏，增强了面板的导热性。 在两个高导热材料面板之间也引入低导热材料。 交替的半导体材料通过在预定导热率的孔内冲压通孔并填充n型和p型浆料而引入到变化的导热层内，或者还可以通过筛选技术和线结构的层压线性或径向扇出图案 。 面板内的液体通道用于增强热能传递。 使用MLC技术将热电器件物理地并入IC封装。

公开(公告)号：US06156091A

公开(公告)日：2000-12-05

申请号：US378624

申请日：1999-08-20

申请人： Jon A. Casey

发明人： Jon A. Casey

IPC分类号： B22F3/10 ,  B22F3/11 ,  C04B35/638 ,  C04B35/64 ,  C04B38/06 ,  B29C65/00

CPC分类号： B22F3/1021 ,  B22F3/1121 ,  C04B35/638 ,  C04B35/64 ,  C04B38/06 ,  C04B38/068 ,  C04B2111/00267 ,  C04B2111/00482 ,  C04B2111/00793

摘要： A ceramic contact sheet and setter tile with controlled porosity is introduced, along with the method for making the same. The amount of porosity is controlled by the volume percentage, particle size, and particle shape of a fugitive phase which can be added to the original refractory material slurry used to fabricate setter tiles and contact sheets. The fugitive phase can be used independently to introduce porosity in setter tiles and contact sheets or in conjunction with partial densification. Since porosity is not solely dependent upon partial sintering, higher porosity levels can be achieved with less impact on subsequent mechanical properties of the resultant refractory material.

公开(公告)号：US5866470A

公开(公告)日：1999-02-02

申请号：US727109

申请日：1996-10-08

申请人： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

发明人： Jon A. Casey ,  Michael A. Cohn ,  John J. Garant ,  Abubaker S. Shagan ,  Candace A. Sullivan ,  Robert J. Sullivan ,  Andrew H. Vogel

IPC分类号： H01G4/30 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  H01L21/30 ,  H01L21/46

CPC分类号： H01G4/30 ,  H01L21/481 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/49894 ,  H05K3/0097 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/1536 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S156/925 ,  Y10T156/1163 ,  Y10T156/1911

摘要： A process for making multiple microelectronic ceramic substrates uses an interface layer between stacked layers of green sheets that are laminated with the interface layer, then fired to produce the ceramic substrates. The interface layer acts to protect the substrates, and to hold them together before firing, then thermally degrades at a desired point in the firing cycle to separate the individual substrates. The invention also includes the ceramic substrates produced by the method.

摘要翻译： 制造多个微电子陶瓷基板的方法使用与界面层层叠的生片层叠层之间的界面层，然后烧制以制造陶瓷基板。 界面层用于保护基底，并在烧制之前将它们保持在一起，然后在烧制循环中的所需点处热分解以分离各个基底。 本发明还包括通过该方法制造的陶瓷基板。

公开(公告)号：US5601672A

公开(公告)日：1997-02-11

申请号：US333010

申请日：1994-11-01

申请人： Jon A. Casey ,  Dinesh Gupta ,  James R. Wylder

发明人： Jon A. Casey ,  Dinesh Gupta ,  James R. Wylder

IPC分类号： C04B35/111 ,  C04B35/622 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46 ,  B32B31/12 ,  B32B31/26

CPC分类号： H05K3/4629 ,  C04B35/111 ,  C04B35/62218 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/462 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2203/063 ,  H05K3/4061 ,  H05K3/4623 ,  Y10T156/1056 ,  Y10T29/49163

摘要： Method for producing ceramic laminates from a plurality of greensheet layers which include one or more thin greensheet layers, e.g. having a thickness less than about 3 mils, with interposed patterned circuit layers and conductive vias, while avoiding the loss of strength and the distortion encountered when paste compositions are pre-applied to such thin greensheet layers. The invention avoids the aforementioned problems by the use of a plurality of greensheet layers including thicker, paste-resistant greensheet layers having a thickness greater than the thin greensheet layer, e.g., between 5 and 10 mils, each pair of the thicker greensheet layers confining therebetween an unscreened thin greensheet layer, one of the thicker greensheet layers also being screened with the circuit pattern layer normally applied to the interposed thin greensheet layer. Thereafter the superposed layers are laminated and sintered to form the composite.

摘要翻译： 用于从多个毛坯层制造陶瓷层压板的方法，所述多个毛坯层包括一个或多个薄的毛坯层，例如， 具有小于约3密耳的厚度，具有插入的图案化电路层和导电通孔，同时避免了当将糊剂组合物预先施加到这种薄的毛坯层时遇到的强度损失和失真。 本发明通过使用多个毛坯层来避免上述问题，所述多个毛坯层包括厚度大于薄的毛坯层的厚度较大的耐膏状毛坯层，例如在5至10密耳之间，每对较厚的毛坯层限制在它们之间 未筛选的薄毛坯层，较厚的毛坯层之一也被通常施加到插入的薄毛坯层上的电路图案层进行筛选。 然后将叠层层压并烧结以形成复合材料。

公开(公告)号：US5552232A

公开(公告)日：1996-09-03

申请号：US361351

申请日：1994-12-21

申请人： Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

发明人： Jon A. Casey ,  Carla N. Cordero ,  Benjamin V. Fasano ,  David B. Goland ,  Robert Hannon ,  Jonathan H. Harris ,  Lester W. Herron ,  Gregory M. Johnson ,  Niranjan M. Patel ,  Andrew M. Reitter ,  Subhash L. Shinde ,  Rao V. Vallabhaneni ,  Robert A. Youngman

IPC分类号： B32B18/00 ,  B22F7/02 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  B22F3/00

CPC分类号： C04B41/009 ,  B22F7/02 ,  C04B41/5133 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3731 ,  H05K3/4061 ,  B22F2998/00 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/035 ,  H05K2201/09981 ,  H05K3/248 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/12021 ,  Y10T428/12028 ,  Y10T428/12056 ,  Y10T428/31678

摘要： Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

公开(公告)号：US5304517A

公开(公告)日：1994-04-19

申请号：US11577

申请日：1993-02-01

申请人： Jon A. Casey ,  Sylvia M. DeCarr ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Vivek M. Sura ,  Rao R. Tummala

发明人： Jon A. Casey ,  Sylvia M. DeCarr ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Vivek M. Sura ,  Rao R. Tummala

IPC分类号： C03C14/00 ,  C04B35/195 ,  H01L23/08 ,  C03C8/18

CPC分类号： C03C14/004 ,  C03C2214/08 ,  C03C2214/20

摘要： A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of:______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--Al Nb--Al Ni--Cr Cu--Al Ni--Al Cu--Al--Cr Fe--Al ______________________________________ The slurry is molded and later is sintered in a steam atmosphere at a temperature of about 1000.degree. C. to yield a glass-ceramic substrate toughened against crack propagation and useful in the packaging of semi-conductor device chips.

摘要翻译： 使用包含合金粉末或选自由以下组成的合金的薄片的玻璃 - 陶瓷浆料来描述烧结工艺：-Fe-CrCu-Ti-Fe-Cr-NiAg-Ti-Cr-AlNb-Al-Ni-CrCu -Al-Ni-AlCu-Al-Cr-Fe-Al-该浆料被模制，随后在约1000℃的温度下在蒸汽气氛中烧结，以产生增韧的抗裂纹扩展的玻璃陶瓷基体，并且可用于 半导体器件芯片的封装。

公开(公告)号：US5139851A

公开(公告)日：1992-08-18

申请号：US503493

申请日：1990-03-30

申请人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Arnold I. Baise ,  Richard A. Bates ,  Jon A. Casey ,  David R. Clarke ,  Renuka S. Divakaruni ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Amy T. Matts ,  Robert W. Nufer ,  Srinivasa S. N. Reddy ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/40

CPC分类号： C04B41/4961 ,  C04B41/488 ,  H01L21/4857 ,  H01L23/5383 ,  H05K3/4061 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

公开(公告)号：US5135595A

公开(公告)日：1992-08-04

申请号：US503495

申请日：1990-03-30

申请人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

发明人： John Acocella ,  Peter A. Agostino ,  Arnold I. Baise ,  Richard A. Bates ,  Ray M. Bryant ,  Jon A. Casey ,  David R. Clarke ,  George Czornyj ,  Allen J. Dam ,  Lawrence D. David ,  Renuka S. Divakaruni ,  Werner E. Dunkel ,  Ajay P. Giri ,  Liang-Choo Hsia ,  James N. Humenik ,  Steven M. Kandetzke ,  Daniel P. Kirby ,  John U. Knickerbocker ,  Sarah H. Knickerbocker ,  Anthony Mastreani ,  Amy T. Matts ,  Robert W. Nufer ,  Charles H. Perry ,  Srinivasa S. N. Reddy ,  Salvatore J. Scilla ,  Mark A. Takacs ,  Lovell B. Wiggins

IPC分类号： H05K1/03 ,  C04B41/48 ,  C04B41/49 ,  H01L21/48 ,  H01L23/08 ,  H01L23/538 ,  H05K3/40

CPC分类号： H01L21/4857 ,  C04B41/488 ,  C04B41/4961 ,  H01L23/5383 ,  H05K3/4061 ,  C04B2111/00672 ,  C04B2111/00844 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K2201/09581 ,  H05K2203/1147 ,  H05K2203/308

摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.